Systems, Methods, and Devices for Sealing LED Light Sources in a Light Module

ABSTRACT

A light module includes one or more LEDs coupled to a circuit board, a lens disposed over at least one LED, and an adhesive layer disposed between each LED and the lens. A flange extends from at least one side of the lens. The adhesive layer fixes the lens in an optical alignment over the corresponding LED. The adhesive layer includes at least one of a non-permeable layer with an adhesive material on the top and bottom surfaces, a gas-permeable layer with an adhesive material on the top and bottom surfaces, a deposited material, and an over mold material. An alignment tool including one or more optical recesses and one or more alignment features is used in the assembly of at least one of an optical assembly and a light module that includes the optical assembly. The alignment tool facilitates precise alignment of the lenses over the LEDs.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority to U.S. Provisional Patent ApplicationNo. 61/264,522, entitled “Systems, Methods, and Devices for Sealing LEDLight Sources in a Light Module,” filed Nov. 25, 2009, and to U.S.Provisional Patent Application No. 61/359,060, entitled “Systems,Methods, and Devices for an Air Permeable LED Light Module,” filed Jun.28, 2010, the entirety of both of which are incorporated by referenceherein.

TECHNICAL FIELD

Embodiments of the invention relate generally to light emitting diode(“LED”) light module construction, and more particularly to systems,methods, and devices for providing air permeable passages between theLED light sources of the light module and the surrounding environment.

BACKGROUND

There are many advantages to the use of light emitting diode (LED) diepackages as light sources in light fixtures to produce lightefficiently. Many light fixtures have incorporated arrays of LED lightsources often configured in a bar-shaped housing or module (alsoreferred to as a “light bar” or “LightBAR™”).

A light bar is connected to or includes a heat dissipating carrier towhich the LEDs are thermally coupled. This heat dissipating carrier towhich the LEDs are attached is typically made of extruded or die-castbar of metal, such as a heat conductive aluminum alloy, and may provideheat dissipation to allow proper cooling of the LED, or may have anadditional heat sink or other heat dissipating means attached.Alternatively, the heat dissipating carrier is fabricated using otherthermally conductive materials. In most light bars, the printed circuitboard connects the LEDs to a power source. Often, the circuit board islaminated to the extruded or die-cast bar. The light bars may furtherinclude circuitry to drive the LEDs included in one or more arrays ofLED light sources. Typically, the LED arrays are made up of LED diepackages that each include an LED light source with a lens (or primaryoptic), where each of the LED die packages are in turn associated withan optical system (or secondary optic) to control and/or maximize thelight emitted from the LED die package. In other configurations, the LEDlight source may only have one over-optic to refract light. The lightbars may further include circuitry to drive the LEDs included in thearray. Each of the secondary optics aligned with the LED light sourcemay be varied in shape and/or individually rotated to create a beampattern for the array that is unique from the devices themselves,including all degrees of freedom, e.g. separately determinedtranslation, tilt, and yaw for each lens. The array may includesimilarly colored LEDs, white or otherwise, or various colored LEDs.

Light bars are often shown as a rectangular flat bar, but can assume anytwo dimensional planar shape, such as square, circular, hexagonal,triangular or an arbitrary freeform shape. The light bar, eitherindividually or combined with other light bars, can be the basis of aluminaire that is used for street lighting, pathway lighting, parkingstructure lighting, decorative lighting, and any other type of spreadbeam applications. With the heat sink and power incorporated on or intothe light bar, the light bar can be incorporated into existingluminaires or integrated into new luminaire designs.

Light bars provide the ability to generate a particular beam patternwith an array of LEDs which are mounted on a flat or planar plate, whichmost likely would be parallel to the street or floor. Light bars alsoprovide thermal and electrical distribution required for the LEDs aswell as provide means for protecting the array of LEDs fromenvironmental damage. Conventional methods of sealing against water anddust intrusion for the coupling of the LED die package and the secondaryoptical system have included the use of elastomers (e.g., vulcanizedseals). However, the process of sealing against water and dust intrusionhas also limited the amount of air flow to and from the LED die package.The LED die package is tightly sealed between the circuit board on thebottom, the acrylic over-optic on the top, and elastomers around theperimeter of the LED die package and the over-optic between theover-optic and the circuit board. This substantially air-tight sealprevents gas exchange from the LED die package and the volume created bythe over-optic. Further, it prevents heat and contaminants from exitingthat same area. These issues can lead to degradation of the LED diepackage and premature failure.

SUMMARY

One exemplary embodiment of the invention includes a light module. Thelight module can include a plurality of light emitting diodes (“LEDs”),at least one lens, and an adhesive layer. The LEDs can be coupled to acircuit board. Each lens can be disposed over at least one LED of theplurality of LEDs. Each lens can include a flange extending from atleast one side of the lens. The adhesive layer can be disposed betweeneach LED and the lens. The adhesive layer can fix the lens in an opticalalignment over the corresponding LED.

Another exemplary embodiment of the invention includes a light module.The light module can include a plurality of LED die packages, at leastone secondary lens, and an over mold material. The LED die packages caninclude an LED and a primary lens. The LED die packages can be coupledto a circuit board. Each secondary lens can be disposed over at leastone LED of the plurality of LEDs. Each secondary lens can include aflange extending from at least one side of the secondary lens. The overmold material can be disposed over at least a portion of the circuitboard and at least a portion of the flange of each secondary lens. Theover mold material can harden to fix the secondary lens in an opticalalignment over the LED die package.

Another exemplary embodiment of the invention includes a method ofmanufacturing a light module. The method can include providing aplurality of LED die packages, providing at least one secondary lens,and injecting an over mold material. The LED die packages can include anLED and a primary lens. The LED die packages can be coupled to a circuitboard. Each secondary lens can be disposed over at least one LED of theplurality of LEDs. Each secondary lens can include a flange extendingfrom at least one side of the secondary lens. The over mold material canbe injected over at least a portion of the circuit board and at least aportion of the flange of each secondary lens. The over mold material canharden to fix the secondary lens in an optical alignment over the LEDdie package.

Another exemplary embodiment of the invention includes a method ofmanufacturing a light module. The method can include providing aplurality of LED die packages, providing at least one secondary lens,and depositing an adhesive layer. The LED die packages can include anLED and a primary lens. The LED die packages can be coupled to a circuitboard. Each secondary lens can be disposed over at least one LED of theplurality of LEDs. Each secondary lens can include a flange extendingfrom at least one side of the secondary lens. The adhesive layer can bedeposited between each LED die package and the secondary lens. Theadhesive layer can fix the secondary lens in an optical alignment overthe LED die package.

Another exemplary embodiment of the invention includes a method ofmanufacturing a light module. The method can include providing aplurality of LED die packages, providing at least one secondary lens,and providing an adhesive layer. The LED die packages can include an LEDand a primary lens. The LED die packages can be coupled to a circuitboard. Each secondary lens can be disposed over at least one LED of theplurality of LEDs. Each secondary lens can include a flange extendingfrom at least one side of the secondary lens. The adhesive layer can bedisposed between each LED die package and the secondary lens. Theadhesive layer can fix the secondary lens in an optical alignment overthe LED die package.

Another exemplary embodiment of the invention includes a light module.The light module can include a plurality of LEDs, at least one lens, anda gas-permeable layer. The LEDs can be coupled to a circuit board. Eachlens can be disposed over at least one LED of the plurality of LEDs.Each lens can include a flange extending from at least one side of thelens. The gas-permeable layer can be disposed between the circuit boardand each lens. The gas-permeable layer can include a top side and abottom side, where the bottom side can include a first adhesive materialand the top side can include a second adhesive material. The firstadhesive material can adhere the gas-permeable layer to the circuitboard and the second adhesive material can fix the lens in an opticalalignment over the corresponding LED.

Another exemplary embodiment of the invention includes a light module.The light module can include a plurality of LEDs, at least one lens, anda tape layer. The LEDs can be coupled to a circuit board. Each lens canbe disposed over at least one LED of the plurality of LEDs. Each lenscan include a flange extending from at least one side of the lens. Thetape layer can be disposed between the circuit board and each lens. Thetape layer can include a top side and a bottom side, where the bottomside can include a first adhesive material and the top side can includea second adhesive material. The first adhesive material can adhere thetape layer to the circuit board.

Another exemplary embodiment of the invention includes a light module.The light module can include a plurality of LEDs, at least one lens, afirst layer, a second layer, a first adhesive material, a secondadhesive material, and a third adhesive material. The LEDs can becoupled to a circuit board. Each lens can be disposed over at least oneLED of the plurality of LEDs. Each lens can include a flange extendingfrom at least one side of the lens. The first layer can be disposedbetween the circuit board and each lens. The first layer can include aplurality of first openings and a plurality of first apertures. Eachfirst opening can be configured to be disposed around at least a portionof one of the LEDs. Each first aperture can be in fluid communicationwith one of the first openings and can extend outside of a footprint ofthe lens disposed over the associated first opening. The second layercan be disposed between the first layer and each lens. The second layercan include a plurality of second openings and a plurality of thirdopenings. Each second opening can be configured to be disposed around atleast a portion of one of the LEDs and substantially vertically alignedwith one of the plurality of first openings. Each third opening can bevertically aligned with one of the plurality of first openings. Thefirst adhesive material can be disposed between the first layer and thecircuit board and can adhere the first layer to the circuit board. Thesecond adhesive material can be disposed between the first layer and thesecond layer and can adhere the first and second layers together. Thethird adhesive material can be disposed above the second layer.

Another exemplary embodiment of the invention includes a light module.The light module can include a circuit board, a conformal coating, aplurality of LEDs, at least one lens, a first layer, a first adhesivematerial, and a second adhesive material. The circuit board can includea top surface. The conformal coating can be applied to a portion of thetop surface of the circuit board, thereby creating at least one airchannel on the top surface of the circuit board. The LEDs can be coupledto a circuit board. Each lens can be disposed over at least one LED ofthe plurality of LEDs. Each lens can include a lens cavity and a flangeextending from at least one side of the lens. At least one lens cavitycan be in fluid communication with at least one of the air channels. Thefirst layer can be disposed between the circuit board and each lens. Thefirst layer can include a plurality of first openings and a plurality ofsecond openings. Each first opening can be configured to be disposedaround at least a portion of one of the LEDs. Each second opening can bevertically aligned with and in fluid communication with at least one ofthe air channels. The first adhesive material can be disposed betweenthe first layer and the circuit board and can adhere the first layer tothe conformal coating on the top surface of the circuit board. Thesecond adhesive material can be disposed above the first layer.

Another exemplary embodiment of the invention includes a light module.The light module can include a circuit board, at least one air channel,a plurality of LEDs, at least one lens, a first layer, a first adhesivematerial, and a second adhesive material. The circuit board can includea top surface. The air channel can be etched into the top surface of thecircuit board. The LEDs can be coupled to a circuit board. Each lens canbe disposed over at least one LED of the plurality of LEDs. Each lenscan include a lens cavity and a flange extending from at least one sideof the lens. At least one lens cavity can be in fluid communication withat least one of the air channels. The first layer can be disposedbetween the circuit board and each lens. The first layer can include aplurality of first openings and a plurality of second openings. Eachfirst opening can be configured to be disposed around at least a portionof one of the LEDs. Each second opening can be vertically aligned withand in fluid communication with at least one of the air channels. Thefirst adhesive material can be disposed between the first layer and thecircuit board and can adhere the first layer to the top surface of thecircuit board. The second adhesive material can be disposed above thefirst layer.

Another exemplary embodiment of the invention includes a method ofmanufacturing an optical assembly. The method can include providing analignment tool. The alignment tool can include one or more opticalrecesses and one or more first alignment features. The method also caninclude inserting an optic into one or more of the optical recesses. Themethod also can include adhesively coupling an adhesive layer to theoptics. The adhesive layer can include one or more second alignmentfeatures. The first and second alignment features can be substantiallyvertically aligned when the adhesive layer is adhesively coupled to theoptics. The method also can include compressing the adhesive layer to atleast the optics. The method also can include removing at least thecompressed adhesive layer and the optics from the alignment tool.

Another exemplary embodiment of the invention includes a method ofmanufacturing a light module. The method can include providing analignment tool. The alignment tool can include one or more opticalrecesses and one or more first alignment features. The method also caninclude placing an optical assembly into the alignment tool. The opticalassembly can include one or more second alignment features and one ormore optics coupled to at least an adhesive layer. Each optic can beinserted into a corresponding optical recess. The first and secondalignment features can be substantially vertically aligned. The methodalso can include adhesively coupling a circuit board to the adhesivelayer of the optical assembly. The circuit board can include one or morethird alignment features. The first, second, and third alignmentfeatures can be substantially vertically aligned. The method also caninclude compressing the circuit board to at least the optical assembly.

Another exemplary embodiment of the invention includes an alignmenttool. The alignment tool can include a platform having a top surface.The platform can include one or more alignment features and one or moreoptical recesses. The alignment features and the optical recesses can bepositioned on the top surface. The optical recesses can be configured toreceive an optic.

Another exemplary embodiment of the invention includes a light module.The light module can include a circuit board, a plurality of lightemitting diodes (LEDs), at least one lens, an adhesive layer, and atleast one air channel. The circuit board can include a top surface. TheLEDs can be coupled to the circuit board. Each lens can be disposed overat least one LED of the plurality of LEDs and can include a lens cavity.The adhesive layer can be disposed between the circuit board and eachlens and can include a plurality of first openings where each firstopening can be configured to be disposed substantially around at least aportion of one of the LEDs. At least one air channel can be formedsubstantially along the top surface of the circuit board. The airchannels can extend from at least one lens cavity to an edge of thelight module. The air channels can provide fluid communication betweenat least one lens cavity and an outside environment located exterior tothe light module.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing and other features and aspects of the invention are bestunderstood with reference to the following description of certainexemplary embodiments, when read in conjunction with the accompanyingdrawings, wherein:

FIG. 1 is a perspective view of a complete LED light bar including oneor more optics in accordance with embodiments of the present invention;

FIG. 2 is a cross-sectional view of a portion of a complete LED lightbar in accordance with one embodiment of the present invention;

FIG. 3 is an exploded view of an LED light bar without the cover inaccordance with one exemplary embodiment of the present invention;

FIG. 4 is an exploded view of a portion of the LED light bar of FIG. 3showing representative air paths between the LED die package and theoutside environment in accordance with the exemplary embodiment of FIG.3;

FIGS. 5A and 5B are a pair of top plan views of a portion of the LEDlight bar of FIG. 3 showing representative air paths between the LED diepackage and the outside environment in accordance with the exemplaryembodiment of FIG. 3;

FIGS. 6A and 6B are additional views of a portion of the LED light barof FIG. 3 showing representative air paths between the LED die packageand the outside environment in accordance with the exemplary embodimentof FIG. 3;

FIG. 7 is a partial cross-sectional view of a portion of the LED lightbar of FIG. 3 showing representative air paths from the LED die packageto the outside environment in accordance with the exemplary embodimentof FIG. 3;

FIG. 8 is an exploded view of an LED light bar without the cover andwith one or more air permeable layers in accordance with anotherexemplary embodiment of the present invention;

FIGS. 9A and 9B are additional views of a portion of the LED light barof FIG. 8 showing representative air paths between the LED die packageand the outside environment in accordance with the exemplary embodimentof FIG. 8;

FIGS. 10A and 10B are additional views of a portion of the LED light barof FIG. 8 showing representative air paths between the LED die packageand the outside environment in accordance with the exemplary embodimentof FIG. 8;

FIG. 11 is a partial cross-sectional view of a portion of the LED lightbar of FIG. 8 showing representative air paths from the LED die packageto the outside environment in accordance with the exemplary embodimentof FIG. 8;

FIG. 12 is an exploded view of an LED light bar without the cover andwith one or more air permeable layers in accordance with anotherexemplary embodiment of the present invention;

FIG. 13 is a partial cross-sectional view of a portion of the LED lightbar of FIG. 12 showing an air channel and a breathing port aperture inaccordance with an exemplary embodiment of FIG. 12;

FIG. 14 is a perspective view of a portion of the LED light bar of FIG.12 showing the air channel and the breathing port aperture of FIG. 12 inaccordance with an exemplary embodiment of FIG. 12;

FIG. 15 is a partial cross-sectional view of a portion of the LED lightbar of FIG. 12 showing representative air paths from the LED die packageto the outside environment in accordance with the exemplary embodimentof FIG. 12;

FIG. 16 is a partially exploded view of a portion of an LED light barwith one or more air channels in accordance with another exemplaryembodiment of the present invention;

FIG. 17 is an exploded view of a portion of a lens set for the LED lightbar of FIG. 16 having one or more air permeable layers in accordancewith an exemplary embodiment of FIG. 16;

FIG. 18 is a partial cross-sectional view of a portion of the LED lightbar of FIG. 16 showing representative air paths from the LED die packageto the outside environment in accordance with the exemplary embodimentof FIG. 16;

FIG. 19 is a partially exploded view of a portion of an LED light barwith one or more air channels in accordance with another exemplaryembodiment of the present invention;

FIG. 20 is an exploded view of a portion of a lens set for the LED lightbar of FIG. 19 having one or more air permeable layers in accordancewith an exemplary embodiment of FIG. 19;

FIG. 21 is a partial cross-sectional view of a portion of the LED lightbar of FIG. 19 showing representative air paths from the LED die packageto the outside environment in accordance with the exemplary embodimentof FIG. 19;

FIG. 22 illustrates an LED light source and an optic with a fluiddeposition surrounding the LED light source to seal the optic to the PCboard in accordance with another exemplary embodiment of the presentinvention;

FIG. 23 illustrates a cross-sectional view of a portion of a light barhaving an optic formed with, and rigidly held in place by, an over moldmaterial where the over mold material provides a bond between the opticand utilizes grooves or slots on a flange of the optic for bonding theoptic with an over mold material in accordance with another exemplaryembodiment of the present invention;

FIG. 24 illustrates a bottom view of an optic in accordance with oneexemplary embodiment of the present invention;

FIG. 25 illustrates a flowchart of a method for performing an over moldinjection process in accordance with one exemplary embodiment of thepresent invention;

FIG. 26 illustrates a flowchart of a method for assembling a portion ofthe light bar incorporating the use of one of the adhesive layers inaccordance with one exemplary embodiment of the invention;

FIG. 27 shows a perspective view of an alignment tool having one or moreoptical recesses and one or more alignment features in accordance withone exemplary embodiment;

FIG. 28 shows a perspective view of an optical assembly in accordancewith an exemplary embodiment;

FIG. 29 shows the optical assembly placed on the alignment tool inaccordance with an exemplary embodiment;

FIG. 30 shows a backing material being removed from the optical assemblyto expose the adhesive material in accordance with one exemplaryembodiment;

FIG. 31 shows an alignment device inserted through one or more alignmentfeatures of the optical assembly and into the one or more verticallyaligned alignment features of the alignment tool in accordance with anexemplary embodiment;

FIG. 32 shows a PC board being aligned with the optical assembly inaccordance with one exemplary embodiment;

FIG. 33 shows the adhesively coupled PC board and the optical assemblybeing removed from the alignment tool in accordance with one exemplaryembodiment;

FIG. 34 shows the adhesively coupled PC board and the optical assemblybeing compressed in accordance with one exemplary embodiment;

FIG. 35 illustrates a flowchart of a method for assembling an opticalassembly in accordance with one exemplary embodiment of the invention;

FIG. 36 shows an alignment tool with one or more optics disposed withinthe optical recesses in accordance with one exemplary embodiment;

FIG. 37 shows a gap filler positioned on the alignment tool andsurrounding the optics in accordance with one exemplary embodiment;

FIG. 38 shows an alignment device inserted through one or more alignmentfeatures of the gap filler and into the one or more vertically alignedalignment features of the alignment tool in accordance with an exemplaryembodiment;

FIG. 39 shows an adhesive layer being adhesively coupled to the gapfiller and the optics in accordance with one exemplary embodiment;

FIG. 40 shows the alignment device removed from the alignment tool inaccordance with one exemplary embodiment;

FIG. 41 shows the adhesively coupled adhesive layer, the gap filler, andthe optics and the alignment tool being compressed in accordance withone exemplary embodiment;

FIG. 42 shows an optical assembly being removed from the alignment toolin accordance with one exemplary embodiment;

FIG. 43 is an exploded view of an LED light bar without the cover inaccordance with another exemplary embodiment of the present invention;

FIG. 44 is a top plan view of a portion of the LED light bar of FIG. 43showing representative air paths between the LED die package and theoutside environment in accordance with the exemplary embodiment of FIG.43;

FIG. 45 is a partially exploded view of a portion of an LED light barwith one or more air channels in accordance with another exemplaryembodiment of the present invention; and

FIG. 46 is a partially exploded view of a portion of an LED light barwith one or more air channels in accordance with another exemplaryembodiment of the present invention.

The drawings illustrate only exemplary embodiments of the invention andare therefore not to be considered limiting of its scope, as theinvention may admit to other equally effective embodiments.

BRIEF DESCRIPTION OF EXEMPLARY EMBODIMENTS

Some exemplary embodiments of the present invention are directed to anLED light bar having air permeable cavities, sections or layers to allowair to transition between the area surrounding the LED and the exteriorof the light bar. Some of these exemplary embodiments of the inventionalso are directed to fixing optical components over LED die packages forlight modules such as LED light bars incorporated into light fixtureswhile maintaining environmental protection for the light bar. Forinstance, in some exemplary embodiments of the invention, a highperformance adhesive “sandwich” layer is added to the substrate of aprinted circuit board such that the adhesive layer locates the opticalcomponent, particularly in the vertical (or “Z”) axis, relative to thelight source, seals the optic to the substrate containing the LED diepackages (e.g., circuit board), and/or provides one or more air pathwaysfor allowing air to transition between the area surrounding the LED andthe exterior of the light bar. This high performance adhesive “sandwich”layer is fabricated is various manners, which are described below. Inanother embodiment of the invention, an adhesive material, such assilicone, is applied to the substrate of a printed circuit board thatseals the optic relative to the light source. In some exemplaryembodiments, the application of the adhesive and placement of the opticsare accomplished manually using a fixture for placement. Alternatively,according to some exemplary embodiments, the application of the adhesiveand placement of the optics are automated by a computer controlledmachine, including placing the optics on a tape and reel feeder (ormagazine) with a “pick and place” machine. In yet another exemplaryembodiment of the invention, an injection molded material is used torigidly fix the array of optics as one solid piece. The seal or bondprovided by the various exemplary embodiments of the invention may besuch that the seal or bond satisfies ingress protection (IP) standardsestablished to ensure component protection from various environmentalelements (e.g., water, dirt, etc.).

The systems and methods described herein may provide several advantagesincluding providing better weatherproofing seals between the opticalcomponents and LED die packages and more accurate alignment of theoptical components and LED die packages when attaching and sealing anexisting optic to a PC board maintaining the existing relationshipbetween the optic and the LED. The systems, methods, and apparatusesdescribed herein allow for better consistency in large scalemanufacturing of light bars as well as achieve a more robust light barthat is more weather resistant, environmentally resilient, and in somecases, submersible.

According to some exemplary embodiments, a primary lens is disposed overand around one or more LEDs or LED die packages and a secondary lens isdisposed over and around one or more primary lens. The term “optic”refers to either the primary or the secondary lens.

Embodiments of the invention now will be described more fullyhereinafter with reference to the accompanying drawings, in whichembodiments of the invention are shown. This invention may, however, beembodied in many different forms and should not be construed as limitedto the embodiments set forth herein; rather, these embodiments areprovided so that this disclosure will be thorough and complete, and willfully convey the scope of the invention to persons having ordinary skillin the art. Like numbers refer to like elements throughout.

Embodiments of the invention also are described below with reference toblock diagrams and flowchart illustrations of systems, methods, andapparatuses. It will be understood that each block of the block diagramsand flowchart illustrations, and combinations of blocks in the blockdiagrams and flowchart illustrations, can be implemented manually or byspecial purpose hardware-based computer systems that perform thespecified functions, elements or steps, or combinations of specialpurpose hardware and computer instructions. With respect to computerprogram instructions, they may be loaded onto a general purposecomputer, special purpose computer such as a CNC machine, or otherprogrammable data processing apparatus to produce a machine, such thatthe instructions which execute on the computer or other programmabledata processing apparatus create means for implementing the functionsspecified in the flowchart block or blocks. These computer programinstructions may also be stored in a computer-readable memory that candirect a computer or other programmable data processing apparatus tofunction in a particular manner, such that the instructions stored inthe computer-readable memory produce an article of manufacture includinginstruction means that implement the function specified in the flowchartblock or blocks. The computer program instructions may also be loadedonto a computer or other programmable data-processing apparatus to causea series of operational elements or steps to be performed on thecomputer or other programmable apparatus to produce acomputer-implemented process such that the instructions that execute onthe computer or other programmable apparatus provide elements or stepsfor implementing one or more functions specified in the flowchart blockor blocks.

FIG. 1 is a perspective view of a complete LED light bar 100 includingone or more optics 110 in accordance with exemplary embodiments of thepresent invention. FIG. 2 is a cross-sectional view of a portion of acomplete LED light bar 100 in accordance with one exemplary embodimentof the present invention. Referring to FIGS. 1 and 2 and in accordancewith the exemplary embodiment illustrated in FIG. 2, the complete lightbar 100 includes a common substrate 210, one or more LEDs or LED diepackages 220 mounted to the common substrate 210, an adhesive layer 230,a gap filler 240, one or more optics 110, and a cover 120.

According to some exemplary embodiments, the common substrate 210,hereinafter referred to as a printed circuit board or PC board, includesone or more sheets of ceramic, metal, laminate, circuit board, Mylar®,or another material. The PC board 210 also includes several apertures212 for receiving screws 105 (FIG. 1). According to one exemplaryembodiment, the apertures 212 lie axially and centrally along the lengthof the PC board 210; however, these apertures 212 can lie in a differentpattern in other exemplary embodiments. The PC board 210 provides aconvenient means to provide power to the LEDs 220 and are known topeople having ordinary skill in the art. However, other means forconveying power to the LEDs 220 also are contemplated herein, forexample, connectors, sockets, plugs, direct wiring, and other meansknown to people having ordinary skill in the art.

Each LED or LED die package 220 includes at least one chip ofsemi-conductive material that is treated to create a positive-negative(“p-n”) junction. When the LED or LED die package 220 is electricallycoupled to a power source, such as a driver 310 (FIG. 3), current flowsfrom the positive side to the negative side of each junction, causingcharge carriers to release energy in the form of incoherent light.

The adhesive layer 230 is disposed between the surface of the PC board210 and at least a flange portion 202 of one or more optics 110 that aredisposed over each LED or LED die package 220. One example of theadhesive layer 230 is a high performance, double-sided tape. Theadhesive layer 230 includes multiple layers, also referred to as asandwich of layers, according to some exemplary embodiments, while inother exemplary embodiments, the adhesive layer 230 includes a singlelayer. A bottom surface 232 of the adhesive layer 230 adheres to thesurface of the substrate 210, while at least a portion of a top surface234 of the adhesive layer 230 adheres to at least the flange portion 202of one or more optics 110. In certain exemplary embodiments, theadhesive layer 230 protects the LEDs or LED die packages 220 and the PCboard 210 from environmental contaminants. In some exemplaryembodiments, the adhesive layer 230 includes one or more gas-permeablelayers that allows air and/or other gases to permeate therethrough.Specifically, the adhesive layer 230 facilitates the exchange of air orgas between the area surrounding the LED or LED die packages 220 and theexterior of the light bar 100. Some examples of gas-permeable layersinclude, but are not limited to, Tyvek®, high density polyethylene,burlap, canvas, silicone, and other gas-permeable materials known topeople having ordinary skill in the art.

The gap filler 240 is disposed between the adhesive layer 230 and thecover 120 and positioned adjacent to the flange portion 202. The gapfiller 240 adheres to at least a portion of the top surface 234 of theadhesive layer 230. According to some exemplary embodiments, the gapfiller 240 provides additional sealing and weather proofing benefits.However, in some exemplary embodiments, these benefits are achieved bythe adhesive layer 230 without the use of the gap filler 240, therebymaking the gap filler 240 optional. The gap filler 240 is fabricatedusing Tyvek®, however, other materials, including, but not limited to,high density polyethylene, burlap, canvas, and other thermoplastics andother non-woven materials known to people having ordinary skill in theart, can be used for fabricating the gap filler 240.

The optic 110 includes the flange portion 202 and is disposed over theLED or LED die package 220. The optic 110 receives the light emittedfrom the LED or LED die package 220 and distributes the light to adesired illumination area. The optic 110 can be disposed over either asingle LED or LED die package 220 or multiple LEDs or multiple LED diepackages 220. According to some exemplary embodiments, the optic 110 isdesigned to receive light from the LED or LED die package 220 that theoptic 110 is disposed over and direct light to the desired illuminationarea in a predetermined manner, which includes one or more of direction,pattern, and intensity. Each optic 110 used in the light bar 100 isdesigned the same according to some exemplary embodiments, while one ormore optics 110 are designed differently than another optic 110 used inthe same light bar 100 in accordance with other exemplary embodiments.The optic 110 is fabricated using an acrylic material; however, theoptic 110 can be fabricated using other transparent or translucentmaterial, such as glass.

The cover 120 is disposed over at least a portion of the flange portion202 of each optic 110 and the gap filler 240, if utilized. In theembodiments where the gap filler 240 is not used, the cover is disposedover at least a portion of the flange portion 202 of each optic 110 andthe adhesive layer 230. The cover 120 includes one or more apertures 125that allow for a portion of the optics 110 to extend beyond the surfaceof the cover 120. The cover 120 is fabricated using a metal or metalalloy; however, other suitable materials can be used in other exemplaryembodiments.

FIGS. 3-7 present an exemplary embodiment for an LED light bar 100having one or more air permeable layers that provide a pathway for airto enter and exit the area surrounding each LED die package 220. FIG. 3is an exploded view of the LED light bar 100 without the cover 120 inaccordance with one exemplary embodiment of the present invention.Referring now to FIG. 3, the exemplary LED light bar 100 includes the PCboard 210, one or more LEDs or LED die packages 220 mounted to the PCboard 210, the adhesive layer 230, the gap filler 240, and one or moreoptics 110. Although these component have been previously described,further descriptions of certain components are provided in furtherdetail below in accordance with the exemplary embodiments shown in FIGS.3-7.

According to FIG. 3, the adhesive layer 230 includes a sandwich oflayers to adhere at least the flange portion 202 of one or more optics110 that are disposed over each LED or LED die package 220 and the PCboard 210. The adhesive layer includes three layers; however, greater orfewer number of layers are used to form the adhesive layer 230 in otherexemplary embodiments. The sandwich of layered materials includes amaterial layer 330. This material layer 330 is fabricated using agas-permeable material according to some exemplary embodiments.According to one example, the material layer 330 is fabricated usingTyvek®; however, other gas-permeable materials including, but notlimited to, high density polyethylene, burlap, canvas, silicone, andother gas-permeable materials are used to fabricate the material layer330. The material layer 330 includes several openings 332 for receivingtherethrough the LED or LED die packages 220, the LED drivers 310 andfor providing an opening about the apertures 212 in the PC board 210 forreceiving screws 105 (FIG. 1).

The adhesive layer 230 also includes a first adhesive material 320 onthe bottom side of the material layer 330 and a second adhesive material340 on the top side of the material layer 330. These adhesive materials320, 340 are fabricated using a gas-permeable material according to someexemplary embodiments. According to one example, the adhesive materials320, 340 are fabricated using an acrylic adhesive; however, othergas-permeable materials including, but not limited to, siliconeadhesives and other gas-permeable adhesives are used to fabricate theadhesive materials 320, 340. The material used to fabricate the firstadhesive material 320 is the same material that is used to fabricate thesecond adhesive material 340. However, the first adhesive material 320is fabricated using a different material than used to fabricate thesecond adhesive material 340 according to other exemplary embodiments.In one exemplary embodiment, the adhesive materials 320, 340 are aviscous or semi-viscous material that is applied to the material layer330 and has substantially the same shape as the material layer 330. Forexample, the material layer 330 includes several openings 332 forreceiving therethrough the LED or LED die packages 220, the LED drivers310, and for providing an opening about the apertures 212 in the PCboard 210 for receiving screws 105 (FIG. 1). Thus, the application ofthe viscous or semi-viscous material on the material layer 330 to formboth the first and second adhesive materials 320, 340 also formsmatching openings 322, 342 in both the first adhesive material 320 andthe second adhesive material 340, respectively. The openings 322, 332,and 342 are all vertically aligned. In an alternative embodiment, thefirst and second adhesive materials 320, 340 are laminated onto thebottom side and the top side of the material layer 330. After the firstand second adhesive materials 320, 340 are applied onto the materiallayer 330, they are die cut to provide openings 322, 332, and 342 ineach of the adhesive materials 320, 340 and the material layer 330.Although openings 322, 332, and 342 are illustrated as beinground-shaped, the openings 322, 332, and 342 can be any geometric ornon-geometric shape according to other exemplary embodiments.

The first adhesive material 320 on the bottom side of the material layer330 allows the material layer 330 to adhere to the PC board 210. Thesecond adhesive material 340 on the top side of the material layer 330allows multiple optics 110 and a layer of the gap filler 240, if used,to adhere to the material layer 330. The second adhesive material 340provides a seal around the perimeter of each optic 110. As shown in FIG.3, the gap filler 240 includes several square apertures 302. Theseapertures 302 are aligned with the round openings 332, 322, and 342 ofthe material layer 330 and the adhesive materials 320, 340,respectively. The apertures 302 in the gap filler 240 are square toclear the square perimeter of the exemplary flange portion 202 of theoptic 110. The gap filler 240 is applied over the second adhesivematerial 340 to prevent the collection of dust and contaminants and toadd to the mechanical structure of the adhesive materials 320, 340 andthe material layer 330. Those of ordinary skill in the art willrecognize however, that the size and shape of the openings 322, 332, and342 in the material layer 330 and the adhesive materials 320, 340 andthe apertures 302 in the gap filler 240 can be adjusted based on theshape of the LED or LED die package 220 and the optic 110 being used inthe particular lighting application.

As previously mentioned and in accordance with one exemplary embodiment,the optic 110 is made of acrylic and can represent one or more opticaldevices disposed over each LED or LED die package 220. In addition, incertain exemplary embodiments, the light bar 100 also includes multiplemirrors 350. According to some exemplary embodiments, each mirror isdisposed about at least a portion of one of the LEDs or LED die packages220 and under the optic 110.

The material layer 330 along with the adhesive materials 320, 340 areair or gas-permeable and allow for the exchange of gas through themicrostructure of the material layer 330 and the adhesive materials 320,340, thereby allowing air and airborne contaminants to flow horizontallyand vertically through the material layer 330 and to the exteriorenvironment of the light bar 100. The adhesive materials 320, 340provide a waterproof breathable membrane that further prevent cloggingof the air paths and seal the light bar 100 in such a manner as toachieve an IP 66 rating per international industry standard IEC-60529for the ingress of contaminants.

FIG. 4 is an exploded view of a portion of the LED light bar 100 of FIG.3 showing representative air paths 410 between the LED die package 220and the outside environment in accordance with the exemplary embodimentof FIG. 3. FIGS. 5A and 5B are a pair of top plan views of a portion ofthe LED light bar 100 of FIG. 3 showing representative air paths 410between the LED die package 220 and the outside environment inaccordance with the exemplary embodiment of FIG. 3. FIGS. 6A and 6B areadditional views of a portion of the LED light bar 100 of FIG. 3 showingrepresentative air paths 410 between the LED die package 220 and theoutside environment in accordance with the exemplary embodiment of FIG.3. FIG. 7 is a partial cross-sectional view of a portion of the LEDlight bar 100 of FIG. 3 showing representative air paths 410 from theLED die package 220 to the outside environment in accordance with theexemplary embodiment of FIG. 3. Referring now to FIGS. 4-7, when the LEDor LED die package 220 that is mounted onto the PC board 210 is turnedon, it generates heat. The build up of heat increases the pressureinside of the optic 110. As the pressure increases beyond the pressureof the outside environment, the air or gas inside of the optic 110,which may include contaminants, wants to move to an area of lowerpressure, which includes the outside environment. The material layer 330disposed about the LED or LED die package 220 provides a pathway for theair (and any airborne contaminants), also referred to as an air path410, to transition the air or gas from between the area under the optic110 and the outside environment. The air paths 410 are orientedsubstantially vertically, substantially horizontally, and/or acombination of vertical and horizontal orientations. As shown in FIGS.5A and 5B and with reference to FIG. 4, for instance, the air can movelaterally under the gap filler 240 and through the material layer 330 tothe perimeter of the light bar 100. The air (and any airbornecontaminants) then exits the light bar 100. In addition, as shown inFIG. 7 and with reference to FIG. 4, the air can move laterally underthe gap filler 240 and through the material layer 330 until the air isno longer under the optic 110 or the footprint of the optic 110. At thatpoint, the air (and any airborne contaminants) can move vertically fromthe material layer 330 through the gap filler 240 to the outsideenvironment.

It is also possible for air to flow in the opposite direction as shownin each of FIGS. 4-6, from the outside environment into the areasurrounding the LED or LED die package 220 under the optic 110. Forexample, when the LED or LED die package 220 is turned off, the LED orLED die package 220 cools and the area under the optic 110 also cools.This cooling results in a pressure drop inside the area under the optic110, thereby drawing air towards the LED or LED die package 220. Air isable to flow from the outside environment to the LED or LED die package220 in a manner substantially similar to, but in the reverse of thatdescribed above.

While the exemplary embodiment of FIG. 4-7 shows the air flow from theLEDs or LED die packages 220 to the perimeter of the light bar 100, theair also is capable of flowing in any lateral direction from the LED orLED die package 220 to an area where the air is no longer under theoptic 110. At that point, the air can either exit the light bar 100vertically through the gap filler 240 or continue migrating laterallytowards a perimeter of the light bar 100. Further, while the exemplaryembodiment of FIGS. 3 and 4 shows the material layer 330, the adhesivematerials 320, 340, and the gap filler 240 as being separate components,one or more of the material layer 330, the adhesive materials 320, 340,and the gap filler 240 are capable of being preassembled together as asingle sandwich of layers (either with or without the optic 110) toimprove consistency and to reduce the time to apply these layers to thePC board 210.

FIGS. 8-11 present another exemplary embodiment for an LED light bar 800having one or more air permeable layers that provide a pathway for airto enter and exit the area surrounding each LED die package 220. FIG. 8is an exploded view of an LED light bar without the cover 120 (FIG. 1)and with one or more air permeable layers in accordance with anotherexemplary embodiment of the present invention. Referring now to FIG. 8,the exemplary light bar 800 includes PC board 210, one or more LEDs orLED die packages 220 mounted to the PC board 210, an adhesive layer 810,the gap filler 240, and one or more optics 110. Although several ofthese components have been previously described, further descriptions ofcertain components are provided in further detail below in accordancewith the exemplary embodiments shown in FIGS. 8-11.

The PC board 210 includes one or more LED drivers 310 that provide powerto the LEDs or LED die packages 220 that are mounted to the PC board210. Each LED or LED die package 220 includes at least one chip ofsemi-conductive material that is configured to release energy in theform of incoherent light. The optic 110 includes the flange portion 202and is disposed over the LED or LED die package 220. The optic 110receives the light emitted from the LED or LED die package 220 anddistributes the light to a desired illumination area. In certainexemplary embodiments, the light bar 800 also includes multiple mirrors350. According to some exemplary embodiments, each mirror 350 isdisposed about at least a portion of one of the LEDs or LED die packages220 and under the optic 110. Each of the PC board 210, LEDs or LED diepackages 220, optics 110, and mirrors 350 have been previously describedand are applicable to the current exemplary embodiment.

According to FIG. 8, the adhesive layer 810 includes a sandwich oflayers to adhere at least the flange portion 202 of one or more optics110 that are disposed over each LED or LED die package 220 and the PCboard 210. The adhesive layer 810 includes two layers; however, greateror fewer number of layers are used to form the adhesive layer 810 inother exemplary embodiments. The adhesive layer 810 protects the LED orLED die package 220 and the PC board 210 from environmentalcontaminants. The sandwich of layered materials includes a bottom layer815. At least a portion of the bottom layer 815 includes a gas-permeabletape 830. In one exemplary embodiment, the gas-permeable tape 830 is amoisture resistant venting tape made from non-woven fabric. One exampleof the gas-permeable tape 830 is Tyvek® tape manufactured by DuPont.Another example of the gas-permeable tape 830 is Tesa® tape manufacturedby Tesa AG. However, other gas-permeable tapes known to people havingordinary skill in the art can be used in other exemplary embodiments. Inone exemplary embodiment, the bottom layer 815 also includes a firstadhesive material 820. In some exemplary embodiments, the gas-permeabletape 830 is placed on the surface of the PC board 210 along the outerlongitudinal edges of the light bar 800 and the first adhesive material820 is positioned longitudinally down the center of the light bar 800.The first adhesive material 820 is generally not gas-permeable, but canbe gas-permeable in other exemplary embodiments. According to someexemplary embodiments, the first adhesive material 820 is formed into atape-like structure.

In the exemplary embodiment of FIG. 8, the bottom layer 815 includesseveral openings 832 for receiving therethrough the LEDs or LED diepackages 220, the LED drivers 310, and for providing an opening aboutone or more apertures 212 in the PC board 210 for receiving screws 105(FIG. 1). While these openings 832 are round in the exemplaryembodiment, they can alternatively be any geometric or non-geometricshape and are typically configured to allow at least a portion of theLED or LED die package 220 to extend upward therethrough.

While the first adhesive material 820 and the gas-permeable tape 830 areshown as three separate components in FIG. 8, in an exemplaryembodiment, the first adhesive material 820 and the gas-permeable tape830 are manufactured as a single layer for easier application to the PCboard 210. For instance, the gas-permeable tape 830 and the firstadhesive material 820 are combined using a butt joining operation. Asshown in FIG. 8, the area where the bottom layer 815 transitions fromthe first adhesive material 820 to the gas-permeable tape 830 is alongone or more openings 832 provided for in the bottom layer 815. Theseopenings 832 are disposed about the LEDs or LED die packages 220.However, the exact transitioning positioning from the first adhesivematerial 820 to the gas-permeable tape 830 can be closer or farther fromthe longitudinal edge of the light bar 800 in other exemplaryembodiments. In an alternative embodiment, the entire bottom layer 815is a gas-permeable tape 830. Having the entire bottom layer 815 as agas-permeable tape 830 eliminates the need to combine the gas-permeabletape 830 to the first adhesive material 820 in the bottom layer 815during a pre-manufacturing step.

The adhesive layer 810 also includes a second adhesive material 840. Thesecond adhesive material 840 includes one or more openings 842, whichare aligned with the openings 832 in the bottom layer 815 when disposedon top of the bottom layer 815. In one exemplary embodiment, the secondadhesive material 840 is an adhesive tape having adhesive on both sides(“double-sided tape”) and has substantially the same shape as the bottomlayer 815.

The bottom layer 815 includes sufficient adhesive material to adhere thebottom layer 815 to the surface of the PC board 210. The top side of thesecond adhesive material 840 is adhered to one or more optics 110 and alayer of gap filler 240, if used. The bottom side of the second adhesivematerial 840 is adhered to the top surface of the bottom layer 815. Thegap filler 240 protects the adhesive layer 810 from physical damage andcovers up the sticky portion of second adhesive material 840. As shownin FIG. 8, the gap filler 240 includes several square apertures 302.These apertures 302 are aligned with the round openings 832, 842 of thebottom layer 815 and the second adhesive material 840. The apertures 302in the gap filler 240 are square-shaped to seal around the squareperimeter of the exemplary flange portion 202 of the optics 110. Thoseof ordinary skill in the art will recognize however, that the size andshape of the openings in the bottom layer 815 and the second adhesivematerial 840 and the apertures 302 in the gap filler 240 can be adjustedbased on the shape of the LED or LED die package 220 and the optic 110being used in the particular lighting application.

The gas-permeable tape 830 allows for the exchange of air or gas throughthe microstructure of the gas-permeable tape 830, thereby allowing airand airborne contaminants to flow horizontally and vertically throughthe gas-permeable tape 830 and to the outside environment of the lightbar 100. In addition, the gas-permeable tape 830 provides a waterproofbreathable membrane along the bottom layer 815. The second adhesivematerial 840 prevents clogging of the air paths and seals the light bar800 in such a manner as to achieve an IP 66 rating for the ingress ofcontaminants. Furthermore, the second adhesive material 840 isolates thesealing area for the optic 110 from the air paths.

FIGS. 9A and 9B are additional views of a portion of the LED light bar800 of FIG. 8 showing representative air paths 910 between the LED diepackage 220 and the outside environment in accordance with the exemplaryembodiment of FIG. 8. FIGS. 10A and 10B are additional views of aportion of the LED light bar 800 of FIG. 8 showing representative airpaths 910 between the LED die package 220 and the outside environment inaccordance with the exemplary embodiment of FIG. 8. FIG. 11 is a partialcross-sectional view of a portion of the LED light bar 800 of FIG. 8showing representative air paths 910 from the LED die package 220 to theoutside environment in accordance with the exemplary embodiment of FIG.8. Referring now to FIGS. 9-11, when the LED or LED die package 220 thatis mounted to the PC board 210 is turned on, it generates heat. Thebuild up of heat increases the pressure inside of the optic 110. As thepressure increases beyond the pressure of the outside environment, theair or gas inside of the optic 110, which may include contaminants,wants to move to an area of lower pressure, which includes the outsideenvironment. The gas-permeable tape 830 disposed along the outerlongitudinal edges of the PC board 210 provides a pathway for the air(and any airborne contaminants), also referred to as an air path 910, totransition the air or gas from between the area under the optic 110 andthe outside environment. The air paths 910 are oriented substantiallyvertically, substantially horizontally, and/or a combination of verticaland horizontal orientations. As shown in FIGS. 9-11, for instance, theair can move laterally under the gap filler 240 and the second adhesivematerial 840 and through the gas-permeable tape 830 to the perimeter ofthe light bar 800. The air (and any airborne contaminants) then exitsthe light bar 800. In addition, as shown in FIGS. 9A, 10B, and 11, theair can move laterally under the gap filler 240 and the second adhesivematerial 840 and through the gas-permeable tape 830 until the air is nolonger under the optic 110. At that point, the air (and any airbornecontaminants) can move vertically from the gas-permeable tape 830through the second adhesive material 840 and the gap filler 240 to theoutside environment.

It is also possible for air to flow in the opposite direction as shownin each of FIGS. 9 and 10, from the outside environment to the areasurrounding the LED or LED die package 220 under the optic 110. Forexample, when the LED or LED die package 220 is turned off, the LED orLED die package 220 cools and the area under the optic 110 also cools.This cooling results in a pressure drop inside the area under the optic110, thereby drawing air towards the LED or LED die package 220. Air isable to flow from the outside environment to the LED or LED die package220 in a manner substantially similar to, but in the reverse of thatdescribed above.

While the exemplary embodiments of FIGS. 9-11 show air flow from theLEDs or LED die packages 220 to the perimeter of the light bar 800, inalternative embodiments wherein the gas-permeable tape 830 comprises theentire bottom layer 815, the air also is capable of flowing in anylateral direction from the LED or LED die package 220 to an area wherethe air is no longer under the optic 110. At that point, the air caneither exit the light bar 800 vertically through the second adhesivematerial 840 and the gap filler 240 or continue migrating laterallytowards a perimeter of the light bar 800. Further, while the exemplaryembodiment of FIGS. 8, 9A, and 10B shows the bottom layer 815, thesecond adhesive material 840, and the gap filler 240 as being separatecomponents, one or more of the bottom layer 815, the second adhesivematerial 840, and the gap filler 240 are capable of being preassembledtogether (either with or without the optic 110) as a single sandwich oflayers to improve consistency and to reduce the time to apply theselayers to the PC board 210.

FIGS. 12-15 present another exemplary embodiment for an LED light bar1200 having one or more air permeable layers that provide air channels1212 for air to enter and exit the area surrounding each LED or LED diepackage 220. FIG. 12 is an exploded view of an LED light bar 1200without the cover 120 (FIG. 1) and with one or more air permeable layersin accordance with another exemplary embodiment of the presentinvention. FIG. 13 is a partial cross-sectional view of a portion of theLED light bar 1200 of FIG. 12 showing an air channel 1212 and abreathing port aperture 1222 in accordance with an exemplary embodimentof FIG. 12. Referring now to FIGS. 12 and 13, the exemplary light bar1200 includes PC board 210, one or more LEDs or LED die packages 220mounted to the PC board 210, an adhesive layer 1280, the gap filler 240,and one or more optics 110. Although several of these components havebeen previously described, further descriptions of certain componentsare provided in further detail below in accordance with the exemplaryembodiment shown in FIGS. 12-15.

The PC board 210 includes one or more LED drivers 310 that provide powerto the LEDs or LED die packages 220 that are mounted to the PC board210. Each LED or LED die package 220 includes at least one chip ofsemi-conductive material that is configured to release energy in theform of incoherent light. The optic 110 includes the flange portion 202and is disposed over the LED or LED die package 220. The optic 110receives the light emitted from the LED or LED die package 220 anddistributes the light to a desired illumination area. In certainexemplary embodiments, the light bar 1200 also includes multiple mirrors350 (FIG. 3). According to some exemplary embodiments, each mirror 350(FIG. 3) is disposed about at least a portion of one of the LEDs or LEDdie packages 220 and under the optic 110. Each of the PC board 210, LEDsor LED die packages 220, optics 110, and mirrors 350 (FIG. 3) have beenpreviously described and are applicable to the current exemplaryembodiment.

According to FIG. 12, the adhesive layer 1280 includes a sandwich oflayers of materials to adhere at least the flange portion 202 of one ormore optics 110 that are disposed over each LED or LED die package 220and the PC board 210. The adhesive layer 1280 protects the LED or LEDdie package 220 and the PC board 210 from environmental contaminants.The adhesive layer 280 includes a first carrier material 1210. Accordingto some exemplary embodiments, the first carrier material 1210 isfabricated using a polymer film layer. In one exemplary embodiment, thepolymer film layer is polyethylene terephthalate (PET), Mylar®, Rayon®,Gortex®, polytetrafluoroethylene (PTFE), or any other polymer film knownto people having ordinary skill in the art.

As with the other layers in the other embodiments discussed above, thefirst carrier material 1210 includes one or more openings 1211 forreceiving at least a portion of the LED or LED die package 220therethrough. In addition to and in communication with each one of theopenings 1211 is at least one air channel 1212. In one exemplaryembodiment, the air channel 1212 is a longitudinal aperture extendingfrom one edge of the opening 1211 that receives the LED or LED diepackage 220 therethrough. As shown in FIG. 12, except for the openings1211 nearest to each latitudinal end of the light bar 1200, a pair ofair channels 1212 extend in opposing longitudinal directions for thelight bar 1200. For the openings 1211 nearing the latitudinal end of thelight bar 1200, a single air channel 1212 extends from the opening 1211in the longitudinal direction toward an adjacent opening 1211. While theexemplary embodiment presents pairs of air channels 1212 extending inthe longitudinal direction from each opening 1211, the air channels 1212can extend in any direction and greater or fewer than two air channels1212 extend from each opening 1211 in other exemplary embodiments.

The adhesive layer 1280 also includes a first adhesive material 1205 anda second adhesive material 1215 on the top and bottom sides of the firstcarrier material 1210. According to one example, the adhesive materials1205, 1215 are fabricated using an acrylic adhesive; however, othersuitable materials including, but not limited to, silicone adhesives andother gas-permeable adhesives can be used to fabricate the adhesivematerials 1205, 1215. The material used to fabricate the first adhesivematerial 1205 is the same material that is used to fabricate the secondadhesive material 1215. However, the first adhesive material 1205 isfabricated using a different material than used to fabricate the secondadhesive material 1215 according to other exemplary embodiments. In oneexemplary embodiment, the adhesive materials 1205, 1215 are a viscous orsemi-viscous material that is applied to the first carrier material 1210and has substantially the same shape as the first carrier material 1210.For example, the first carrier material 1210 includes several openings1211 for receiving therethrough the LED or LED die packages 220, the LEDdrivers 310, and for providing an opening about the apertures 212 in thePC board 210 for receiving screws 105 (FIG. 1) and several air channels1212 extending from the openings 1211. Thus, the application of theviscous or semi-viscous material on the first carrier material 1210 toform both the first and second adhesive materials 1205, 1215 also formsmatching openings 1206, 1216 and matching air channels 1207, 1217 inboth the first adhesive material 1205 and the second adhesive material1210, respectively. The openings 1206, 1211, and 1216 are all verticallyaligned. The air channels 1207, 1212, and 1217 are all verticallyaligned. In an alternative embodiment, the first and second adhesivematerials 1205, 1215 are laminated onto the bottom side and the top sideof the first carrier material 1210. After the first and second adhesivematerials 1205, 1215 are applied onto the first carrier material 1210,they are die cut to provide openings 1206, 1211, and 1216 and airchannels 1207, 1212, and 1217 in each of the adhesive materials 1205,1215 and the first carrier material 1210. In an alternative embodiment,the adhesive materials 1205, 1215 are vapor deposited on the firstcarrier material 1210. Although openings 1206, 1211, and 1216 areillustrated as being round-shaped, the openings 1206, 1211, and 1216 canbe any geometric or non-geometric shape according to other exemplaryembodiments.

The adhesive layer 1280 also includes a second carrier material 1220.According to some exemplary embodiments, the second carrier material1220 is fabricated using a polymer film layer. The second carriermaterial 1220 is disposed above the first carrier material 1210 and thesecond adhesive material 1215. In one exemplary embodiment, the polymerfilm layer is polyethylene terephthalate (PET), Mylar®, Rayon®, Gortex®,polytetrafluoroethylene (PTFE), or any other polymer film known topeople having ordinary skill in the art.

As with the first carrier material 1210, the second carrier material1220 also includes one or more openings 1221 for receiving at least aportion of the LED or LED die package 220 therethrough. In addition tothose openings, one or more breathing port apertures 1222 are formedinto the second carrier material 1220. In one exemplary embodiment, thebreathing port apertures 1222 have a circular shape; however, othershapes are contemplated within the scope of this invention. Thebreathing port apertures 1222 are positioned on the second carriermaterial 1220 such that, when positioned over the first carrier material1210, a portion of the breathing port aperture 1222 and at least one,and typically two, of the air channels 1212 will overlap and be in fluidcommunication with one another, as shown, for example, in FIG. 14. Also,once the second carrier material 1220 is positioned over the firstcarrier material 1210, the opening 1221 is vertically aligned withopenings 1206, 1211, and 1216.

The adhesive layer 1280 also includes a third adhesive material 1225 onthe top side of the second carrier material 1220. According to oneexample, the third adhesive material 1225 is fabricated using an acrylicadhesive; however, other suitable materials including, but not limitedto, silicone adhesives and other gas-permeable adhesives can be used tofabricate the third adhesive material 1225. The material used tofabricate the third adhesive material 1225 is the same material that isused to fabricate at least one of the first adhesive material 1205 orthe second adhesive material 1215. However, the third adhesive material1225 is fabricated using a different material than used to fabricate thefirst adhesive material 1205 and the second adhesive material 1215according to other exemplary embodiments. In one exemplary embodiment,the third adhesive material 1225 is a viscous or semi-viscous materialthat is applied to the top side of the second carrier material 1220 andhas substantially the same shape as the second carrier material 1220.For example, the second carrier material 1220 includes several openings1221 for receiving therethrough the LED or LED die packages 220, the LEDdrivers 310, and for providing an opening about the apertures 212 in thePC board 210 for receiving screws 105 (FIG. 1) and several breathingport apertures 1222. Thus, the application of the viscous orsemi-viscous material on the second carrier material 1220 to form thethird adhesive material 1225 also forms matching openings 1226 andmatching breathing port apertures 1227 in the third adhesive material1225. The openings 1221, 1226 are all vertically aligned. The breathingport apertures 1222, 1227 are all vertically aligned. In an alternativeembodiment, the third adhesive material 1225 is laminated onto the topside of the second carrier material 1220. After the third adhesivematerial 1225 is applied onto the second carrier material 1220, they aredie cut to provide openings 1216, 1226 and breathing port apertures1222, 1227 in each of the third adhesive material 1225 and the secondcarrier material 1220. In an alternative embodiment, the third adhesivematerial 1225 is vapor deposited on the second carrier material 1220.Although openings 1221, 1226 are illustrated as being round-shaped, theopenings 1221, 1226 can be any geometric or non-geometric shapeaccording to other exemplary embodiments.

The adhesive layer 1280 also includes the gap filler 240 in certainexemplary embodiments. According to certain exemplary embodiments, thegap filler 240 is fabricated using a non-woven breathable membrane. Thegap filler 240 is disposed over the second carrier material 1220. Incertain exemplary embodiments, the nonwoven breathable membrane is madeof Tyvek® manufactured by Dupont Industries, Tufpak® manufactured byTufpak, Inc., or other comparable materials known to people havingordinary skill in the art. The gap filler 240 and the third adhesivematerial 1225 provide a seal around the perimeter of each optic 115. Asshown in FIG. 12, the gap filler 240 includes several square apertures302. These apertures 302 are aligned with the round LED receivingopenings 1211, 1221, 1206, 1216, and 1226 of the first and secondcarrier materials 1210, 1220 and the first, second, and third adhesivematerials 1205, 1215, and 1225. The apertures 302 in the gap filler 240are square-shaped to seal around the square perimeter of the exemplaryoptic 110. Those of ordinary skill in the art will recognize, however,that the size and shape of the openings 1211, 1221, 1206, 1216, and 1226in the first and second carrier materials 1210, 1220 and the first,second, and third adhesive materials 1205, 1215, and 1225 and theaperture 302 in the gap filler 240 can be adjusted based on the shape ofthe LED or LED die package 220 and the optic 110 being used in theparticular lighting application.

When the sandwich layers are combined to form the adhesive layer 1280,the first adhesive material 1205 on the bottom side of the first carriermaterial 1210 allows the first carrier material 1210 to adhere to the PCboard 210. The second adhesive material 1215 on the top side of thefirst carrier material 1210 allows the two carrier materials 1210, 1220to adhere to one-another. Although it has been described that the secondadhesive material 1215 is applied, laminated, or deposited onto the topside of the first carrier material 1210, the second adhesive material1215 can be applied, laminated, or deposited onto the bottom side of thesecond carrier material 1220 in other exemplary embodiments and stillperform in the same manner. The third adhesive material 1225 on the topside of the second carrier material 1220 allows one or more optics 110and the gap filler 240, if used, to adhere to the second carriermaterial 1220.

The first carrier material 1210 provides air channels 1212 in directfluid communication with the cavity of the optic 110 and the LED or LEDdie package 220. These air channels 1212 also are in fluid communicationwith the breathing port apertures 1222. This combination of fluidcommunications provides a direct pathway for air and airbornecontaminants to flow from the cavity of the optic 110 to the gap filler240, if used, and out from the light bar 1200 to the surroundingenvironment, as shown in FIG. 15. In addition, according to someexemplary embodiments, the gap filler 240 provides a waterproofbreathable membrane along the top layer of the adhesive layer 1280 forthe light bar 1200. The first, second, and third adhesive materials1205, 1215, 1225 are constructed to prevent clogging of the air channels1212 and the breathing port apertures 1222 and seal the light bar 1200in such a manner as to achieve an IP 66 rating per internationalindustry standard IEC-60529 for the ingress of contaminants.Furthermore, the first, second, and third adhesive materials 1205, 1215,1225 isolate the sealing area for the optic 110 from the air channels1212 and the breathing port apertures 1222.

FIG. 14 is a perspective view of a portion of the LED light bar 1200 ofFIG. 12 showing the air channel 1212 and the breathing port aperture1222 of FIG. 12 in accordance with an exemplary embodiment of FIG. 12.FIG. 15 is a partial cross-sectional view of a portion of the LED lightbar 1200 of FIG. 12 showing representative air paths 1510 from the LEDdie package 22 (FIG. 12)0 to the outside environment in accordance withthe exemplary embodiment of FIG. 12. Referring now to FIGS. 14 and 15,when the LED or LED die package 220 (FIG. 12) that is mounted to the PCboard 210 is turned on, it generates heat. The build up of heatincreases the pressure inside of the optic 110. As the pressureincreases beyond the pressure of the outside environment, the air or gasinside of the optic, which may include contaminants, wants to move to anarea of lower pressure, which includes the outside environment. The airmoves laterally along air path 1510 through the air channel 1212. Whenthe air reaches a breathing port aperture 1222, the air moves verticallyalong air path 1510 through the breathing port aperture 1222 and throughthe gap filler 240 to the outside environment of the light bar 1200.Although not illustrated, it is also possible for air to flow in theopposite direction, from the outside environment to the area surroundingthe LED or LED die package 220 under the optic 110. While the exemplaryembodiment of FIGS. 12-15 show the first and second carrier materials1210, 1220, the first, second, and third adhesive materials 1205, 1215,and 1225, and the gap filler 240 as being separate components, one ormore of the first and second carrier materials 1210, 1220, the first,second, and third adhesive materials 1205, 1215, and 1225, and the gapfiller 240 are capable of being preassembled (with or without theinclusion of the optic 110) together as a single sandwich of layers toimprove consistency and to reduce the time to apply these layers to thePC board 210.

FIGS. 16-18 present another exemplary embodiment for an LED light bar1600 having one or more air permeable layers that provide air channels1610 for air to enter and exit the area surrounding each LED or LED diepackage 220 and inside the cavity of the optic 110. FIG. 16 is apartially exploded view of a portion of an LED light bar 1600 with oneor more air channels 1610 in accordance with another exemplaryembodiment of the present invention. Referring now to FIG. 16, theexemplary light bar 1600 includes PC board 210, one or more LEDs or LEDdie packages 220 mounted to the PC board 210, and a lens set 1620, whichincludes one or more optics 110. Although several of these componentshave been previously described, further descriptions of certaincomponents are provided in further detail below in accordance with theexemplary embodiment shown in FIGS. 16-18.

The PC board 210 includes one or more LED drivers 310 (FIG. 3) thatprovide power to the LEDs or LED die packages 220 that are mounted tothe PC board 210. In addition, the PC board 210 includes circuit traces1605 electrically coupled to the LED driver 310 (FIG. 3) and the LEDs orLED die packages 220. The circuit traces 1605 transmit power and/orcontrol signals from the LED driver 310 (FIG. 3) to the LEDs or LED diepackages 220. The PC board 210 also includes one or more layers ofcoating 1615 along the top surface of the PC board 210. According tosome exemplary embodiments, the layers of coating 1615 includes a layerof solder mask. However, in alternative embodiments, the layers ofcoating 1615 includes conformal coating or other hard coatings known topeople having ordinary skill in the art. In certain exemplaryembodiments, multiple layers of solder mask 1615 are applied to the PCboard 210. During application, portions of the PC board 210 areselectively coated using screen printing or other coating techniques toapply one or multiple layers of coating 1615. These portions aretypically adjacent to the LEDs or LED die packages 220. By selectivelyapplying the layers of coating 1615 to certain parts of the PC board210, air channels 1610 are created along the top surface of the PC board210.

Each LED or LED die package 220 includes at least one chip ofsemi-conductive material that is configured to release energy in theform of incoherent light. The optic 110 includes the flange portion 202and is disposed over the LED or LED die package 220. The optic 110receives the light emitted from the LED or LED die package 220 anddistributes the light to a desired illumination area. In certainexemplary embodiments, the light bar 1600 also includes multiple mirrors350 (FIG. 3). According to some exemplary embodiments, each mirror 350(FIG. 3) is disposed about at least a portion of one of the LEDs or LEDdie packages 220 and under the optic 110. Each of the PC board 210, LEDsor LED die packages 220, optics 110, and mirrors 350 (FIG. 3) have beenpreviously described and are applicable to the current exemplaryembodiment.

FIG. 17 is an exploded view of a portion of the lens set 1620 for theLED light bar 1600 of FIG. 16 having air permeable layers in accordancewith an exemplary embodiment of FIG. 16. Referring to FIG. 17, the lensset 1620 includes an adhesive layer 1780, the gap filler 240, and one ormore optics 110. The adhesive layer includes a carrier material 1710, afirst adhesive material 1705, and a second adhesive material 1715. Thecarrier material 1710 includes one or more openings 1716 and one or morebreathing port apertures 1717 and is substantially similar to the secondcarrier material 1220 (FIG. 12). The first adhesive material 1705includes one or more openings 1706 and one or more air channels 1707 andis substantially similar to the second adhesive material 1215 (FIG. 12).The second adhesive material 1715 includes one or more openings 1716 andone or more breathing port apertures 1717 and is substantially similarto the third adhesive material 1225 (FIG. 12). Similarly, the gap filler240, which includes apertures 302, and the optics 110 are substantiallythe same as described in previous exemplary embodiments. For the sake ofbrevity, the descriptions for each of the second carrier material 1220(FIG. 12), the second adhesive material 1215 (FIG. 12), the thirdadhesive material 1225 (FIG. 12), the gap filler 240, and the optics 110of previously described embodiments are incorporated herein with respectto the exemplary embodiment shown in FIGS. 16-18, and will not berepeated.

When the sandwich layers are combined to form the adhesive layer 1780,the first adhesive material 1705 on the bottom side of the carriermaterial 1710 allows the carrier material 1710 to adhere to the layersof coating 1615 on the PC board 210. The second adhesive material 1715on the top side of the carrier material 1710 allows optics 110 and thegap filler 240, if used, to adhere to the carrier material 1710. Thebreathing port apertures 1712 of the carrier material 1710 arepositioned such that they are in vertical alignment with at least aportion of the air channels 1610.

FIG. 18 is a partial cross-sectional view of a portion of the LED lightbar 1600 of FIG. 16 showing representative air paths 1805 from the LEDor LED die package 220 to the outside environment in accordance with theexemplary embodiment of FIG. 16. Referring to FIGS. 16-18, the layers ofcoating 1615 on the surface of the PC board 210 provides air channels1610 in direct fluid communication with the cavity of the optic 110 andthe LED or LED die package 220. These air channels 1610 also are influid communication with the breathing port apertures 1712 of thecarrier material 1710. This combination of fluid communications providesa direct pathway for air and airborne contaminants to flow from thecavity of the optic 110 to the gap filler 240, if used, and out from thelight bar 1600 to the surrounding environment, as shown in FIG. 18. Inaddition, according to some exemplary embodiments, the gap filler 240provides a waterproof breathable membrane along the top layer of theadhesive layer 1780 for the light bar 1600. The first and secondadhesive materials 1705, 1715 are constructed to prevent clogging of theair channels 1610 and the breathing port apertures 1712 and seal thelight bar 1600 in such a manner as to achieve an IP 66 rating perinternational industry standard IEC-60529 for the ingress ofcontaminants. Furthermore, the first and second adhesive materials 1705,1715 isolate the sealing area for the optic 110 from the air channels1610 and the breathing port apertures 1712.

Referring now to FIG. 18, when the LED or LED die package 220 that ismounted to the PC board 210 is turned on, it generates heat. The buildup of heat increases the pressure inside of optic 110. As the pressureincreases beyond the pressure of the outside environment, the air or gasinside of the optic 110, which may include contaminants, wants to moveto an area of lower pressure, which includes the outside environment.The air moves laterally along air path 1805 through the air channel1610. When the air reaches a breathing port aperture 1712, the air movesvertically along air path 1805 through the breathing port aperture 1712and through the gap filler 240 to the outside environment of the lightbar 1600. Although not illustrated, it is also possible for air to flowin the opposite direction, from the outside environment to the areasurrounding the LED or LED die package 220 under the optic 110. Whilethe exemplary embodiment of FIGS. 16-18 shows the carrier material 1710,the first and second adhesive materials 1705, 1715, and the gap filler240 as being separate components, one or more of the carrier material1710, the first and second adhesive materials 1705, 1715, and the gapfiller 240 are capable of being preassembled (with or without theinclusion of the optic 110) together as a single sandwich of layers toimprove consistency and to reduce the time to apply these layers to thePC board 210.

FIGS. 19-21 present another exemplary embodiment for an LED light bar1900 having one or more air permeable layers that provide air channels1905 for air to enter and exit the area surrounding each LED or LED diepackage 220 and inside the cavity of the optic 110. FIG. 19 is apartially exploded view of a portion of an LED light bar 1900 with oneor more air channels 1905 in accordance with another exemplaryembodiment of the present invention. Referring now to FIG. 19, theexemplary light bar 1900 includes PC board 210, one or more LEDs or LEDdie packages 220 mounted to the PC board 210, and a lens set 1620, whichincludes one or more optics 110. Although several of these componentshave been previously described, further descriptions of certaincomponents are provided in further detail below in accordance with theexemplary embodiment shown in FIGS. 19-21.

The PC board 210 includes one or more LED drivers 310 (FIG. 3) thatprovide power to the LEDs or LED die packages 220 that are mounted tothe PC board 210. In addition, the PC board 210 includes circuit traces1605 electrically coupled to the LED driver 310 (FIG. 3) and the LEDs orLED die packages 220. The circuit traces 1605 transmit power and/orcontrol signals from the LED driver 310 (FIG. 3) to the LEDs or LED diepackages 220. The PC board 210 also includes one or more air channels1905 photo-chemically, laser, or mechanically etched into the topsurface of the PC board 210. These air channels 1905 are typicallyadjacent to the LEDs or the LED die packages 220 and extend outwardlyfrom the LEDs or the LED die packages 220 and towards another LED or LEDdie package 220. According to some exemplary embodiments, the airchannel 1905 extending from one LED or LED die package 220 to anotherLED or LED die package 220 is continuous; however, the air channels 1905can be discontinuous in other exemplary embodiments. In some exemplaryembodiments, the PC board 210 also includes one or more layers ofcoating 1910 along the top surface of the PC board 210 in conjunctionwith the etched air channels 1905. The layers of coating 1905 aresubstantially similar to the layers of coating 1615 (FIG. 16) and willtherefore not be described further.

Each LED or LED die package 220 includes at least one chip ofsemi-conductive material that is configured to release energy in theform of incoherent light. The optic 110 includes the flange portion 202and is disposed over the LED or LED die package 220. The optic 110receives the light emitted from the LED or LED die package 220 anddistributes the light to a desired illumination area. In certainexemplary embodiments, the light bar 1900 also includes multiple mirrors350 (FIG. 3). According to some exemplary embodiments, each mirror 350(FIG. 3) is disposed about at least a portion of one of the LEDs or LEDdie packages 220 and under the optic 110. Each of the PC board 210, LEDsor LED die packages 220, optics 110, and mirrors 350 (FIG. 3) have beenpreviously described and are applicable to the current exemplaryembodiment.

FIG. 20 is an exploded view of a portion of a lens set 1620 for the LEDlight bar 1900 of FIG. 19 having one or more air permeable layers inaccordance with an exemplary embodiment of FIG. 19. Referring to FIG.20, the lens set 1620 includes an adhesive layer 1780, the gap filler240, and one or more optics 110. The adhesive layer includes a carriermaterial 1710, a first adhesive material 1705, and a second adhesivematerial 1715. The carrier material 1710 includes one or more openings1716 and one or more breathing port apertures 1717 and is substantiallysimilar to the second carrier material 1220 (FIG. 12). The firstadhesive material 1705 includes one or more openings 1706 and one ormore air channels 1707 and is substantially similar to the secondadhesive material 1215 (FIG. 12). The second adhesive material 1715includes one or more openings 1716 and one or more breathing portapertures 1717 and is substantially similar to the third adhesivematerial 1225 (FIG. 12). Similarly, the gap filler 240, which includesapertures 302, and the optics 110 are substantially the same asdescribed in previous exemplary embodiments. For the sake of brevity,the descriptions for each of the second carrier material 1220 (FIG. 12),the second adhesive material 1215 (FIG. 12), the third adhesive material1225 (FIG. 12), the gap filler 240, and the optics 110 of previouslydescribed embodiments are incorporated herein with respect to theexemplary embodiment shown in FIGS. 19-21, and will not be repeated.

When the sandwich layers are combined to form the adhesive layer 1780,the first adhesive material 1705 on the bottom side of the carriermaterial 1710 allows the carrier material 1710 to adhere to the layersof coating 1615 on the PC board 210. The second adhesive material 1715on the top side of the carrier material 1710 allows optics 110 and thegap filler 240, if used, to adhere to the carrier material 1710. Thebreathing port apertures 1712 of the carrier material 1710 arepositioned such that they are in vertical alignment with at least aportion of the air channels 1905.

FIG. 21 is a partial cross-sectional view of a portion of the LED lightbar 1900 of FIG. 19 showing representative air paths 1905 from the LEDor LED die package 220 to the outside environment in accordance with theexemplary embodiment of FIG. 19. Referring to FIGS. 19-21, the etchingperformed on the surface of the PC board 210 provides air channels 1905in direct fluid communication with the cavity of the optic 110 and theLED or LED die package 220. These air channels 1610 also are in fluidcommunication with the breathing port apertures 1712 of the carriermaterial 1710. This combination of fluid communications provides adirect pathway for air and airborne contaminants to flow from the cavityof the optic 110 to the gap filler 240, if used, and out from the lightbar 1900 to the surrounding environment, as shown in FIG. 21. Inaddition, according to some exemplary embodiments, the gap filler 240provides a waterproof breathable membrane along the top layer of theadhesive layer 1780 for the light bar 1900. The first and secondadhesive materials 1705, 1715 are constructed to prevent clogging of theair channels 1905 and the breathing port apertures 1712 and seal thelight bar 1900 in such a manner as to achieve an IP 66 rating perinternational industry standard IEC-60529 for the ingress ofcontaminants. Furthermore, the first and second adhesive materials 1705,1715 isolate the sealing area for the optic 110 from the air channels1905 and the breathing port apertures 1712.

Referring now to FIG. 21, when the LED or LED die package 220 that ismounted to the PC board 210 is turned on, it generates heat. The buildup of heat increases the pressure inside of optic 110. As the pressureincreases beyond the pressure of the outside environment, the air or gasinside of the optic 110, which may include contaminants, wants to moveto an area of lower pressure, which includes the outside environment.The air moves laterally along air path 2105 through the air channel1905. When the air reaches a breathing port aperture 1712, the air movesvertically along air path 1805 through the breathing port aperture 1712and through the gap filler 240 to the outside environment of the lightbar 1900. Although not illustrated, it is also possible for air to flowin the opposite direction, from the outside environment to the areasurrounding the LED or LED die package 220 under the optic 110. Whilethe exemplary embodiment of FIGS. 19-21 shows the carrier material 1710,the first and second adhesive materials 1705, 1715, and the gap filler240 as being separate components, one or more of the carrier material1710, the first and second adhesive materials 1705, 1715, and the gapfiller 240 are capable of being preassembled (with or without theinclusion of the optic 110) together as a single sandwich of layers toimprove consistency and to reduce the time to apply these layers to thePC board 210.

FIG. 22 illustrates an LED light source 220 and an optic 110 with afluid deposition 2210 surrounding the LED light source 220 to seal theoptic 110 to a PC board 210 in accordance with another exemplaryembodiment of the present invention. The LED light source can be eithera single LED, an LED die package, or a combination of both. The optic110 includes a flange portion 202, as previously described. The fluiddeposition 2210 is formed from silicone and is deposited onto the topsurface of the PC board 210 to surround the LED light source 220.However, according to other exemplary embodiments, the fluid deposition2210 can be formed from other types of adhesive materials, whichinclude, but are not limited to, acrylics, epoxies, and other types ofgas-permeable adhesive materials. The flange portion 202 is positionedon the fluid deposition 2210 and surrounds the LED light source 220. Thefluid deposition 2210 is deposited onto the PC board in a manner suchthat once the optic 110 is placed on top of the fluid deposition 2210,the fluid deposition 2210 does not enter into the cavity area of theoptic 110. Although one LED light source 220 and a corresponding optic110 is shown on the PC board 210, multiple LEDs or LED die packages 220with corresponding optics 110 are coupled directly or indirectly to thePC board 210, in either a uniform or non-uniform pattern, in otherexemplary embodiments. The PC board 210 is used within a light bar (notshown) according to some exemplary embodiments.

According to some exemplary embodiments, the fluid deposition 2210 isplaced on the PC board 210 using a silk screen adhesive, which can beperformed using a machine or manually. Alternatively, according to otherexemplary embodiments, the fluid deposition 2210 is placed on the PCboard 210 by injecting the fluid on the PC board 210 using an injectiontool, which can be performed using a machine or manually. According tosome exemplary embodiments, a “pick and place” machine (not shown) isused to properly align the optics 110 while attaching the optics 110 tothe fluid deposition 2210. In accordance with some exemplary embodimentsshown in FIG. 22, a pick and place machine is programmed and/or manuallyoperated for picking and placing one or more optics 110 on a PC board210 with the fluid deposition 2210 for sealing the optics 110 to the PCboard 210.

In some exemplary embodiments, the thickness of the fluid deposition2210 is set such that the fluid deposition 2210 provides a desiredlocation of the optic 110 in the vertical (or “Z”) axis relative to theLED light source 220 while sealing the optic 110 to the PC board 210.Alternatively or additionally, each optic 110 includes two or moresupport structures 2250 extending away from the flange portion 202 ofthe optic 110 and in a direction towards the PC board 210 once the optic110 is placed onto the PC board 110. The length of the supportstructures 2250 is set such that a dome-shaped portion of the optic 110is positioned at a desired location in the vertical (or “Z”) axisrelative to the LED light source 220. According to some exemplaryembodiments, the length of the support structures 2250 are tenthousandths of an inch; however, the length of the support structures2250 can vary depending upon designer preferences. FIG. 24 illustrates abottom view of the optic 110 in accordance with one or more exemplaryembodiments of the present invention. These support structures 2250 aremore clearly visible in FIG. 24.

FIG. 23 illustrates a cross-sectional view of a portion of a light bar2300 having an optic 2310 formed with, and rigidly held in place by, anover mold material 2350 where the over mold material 2350 provides abond between the optic 2310 and utilizes grooves or slots 2314 on aflange portion 2312 of the optic 2310 for bonding the optic 2310 with anover mold material 2350 in accordance with another exemplary embodimentof the present invention. Referring to FIG. 23, the light bar 2300includes the optic 2310 and the over mold material 2350 that is used tobond the optic 2310 to a PC board (not shown).

The optic 2310 includes the flange portion 2312, where at least aportion of the flange portion 2312 is designed or modified to add orenlarge a “landing area” 2313 for better adhesion to the over moldmaterial 2350 during the over mold injection process. One example of anover mold injection process is described below in conjunction with FIG.25. The “landing area” 2313 is that portion of the flange portion 2312that bonds with the over mold material 2350. According to some exemplaryembodiments, the entire flange portion 2312 is the “landing area” 2313;however, according to other exemplary embodiments, a portion of theflange portion 2312 is the “landing area” 2313. According to someexemplary embodiments, the “landing area” 2313 of the flange portion2312 is designed or modified to further aid in adhesion to the over moldmaterial 2350 by making the surface of the landing area 2313 includebonding enhancement features 2314. These bonding enhancement features2314 includes one or more of a coarse surface, notches, grooves, orother features, such as a non-planar surface, that can enhance bondingof the over mold material 2350 to the “landing area” 2313. For instance,the bonding enhancement features 2314 are incorporated into at least aportion of the flange portion 2312 to allow the over mold material 2350to encapsulate at least the outer most portion of the flange portion2312, thereby increasing the seal and/or adhesion between the over moldmaterial 2350 and the flange portion 2312.

The over mold material 2350 is fabricated using EPDM according to someexemplary embodiments. However, according to other exemplaryembodiments, the over mold material 2350 is fabricated using an acrylicmaterial, a polycarbonate material, or some other suitable materialknown to people having ordinary skill in the art and having the benefitof the present disclosure. In some exemplary embodiments, the over moldmaterial 2350 is fabricated using the same material as used to fabricatethe optic 110; however, a different material can be used to fabricatethe over mold material 2350 than used for fabricating the optic 110.

According to some exemplary embodiments, the optic 2310 is similar tooptic 110 (FIG. 24) in that the optic 2310 includes two or more supportstructures 2250 (FIG. 24) extending away from the flange portion 2312 ofthe optic 2310 and in a direction towards the PC board once the optic2310 is placed onto the PC board. The length of the support structures2250 (FIG. 24) is set such that a dome-shaped portion of the optic 2310is positioned at a desired location in the vertical (or “Z”) axisrelative to the LED light source (not shown).

FIG. 25 illustrates a flowchart 2500 of a method for performing an overmold injection process in accordance with one exemplary embodiment ofthe present invention. In accordance with one exemplary embodiment, theover mold material, which is fabricated from EPDM, an acrylic material,a polycarbonate material, or any other suitable material known to peoplehaving ordinary skill in the art, is injected over one or more optics.During the injection process, a tool is used to hold the optics in placeduring injection of the over mold material. Referring to FIG. 25, theinjection process begins at block 2510 where the optics are placed in atool for correct spacing and configuration. Next, block 2520 is invokedwhere the over mold material is heated until it is ready to be injectedin block 2530. The over mold material is injected over the optics inblock 2530. In some exemplary embodiments, the over mold material isfabricated using a thermoplastic elastomer (“TPE”) material. In otherexemplary embodiments of the invention, the over mold material isfabricated using another elastomer material (e.g., EPDM material, otherplastic material, or the like), an acrylic material, or any othersuitable material that provides a bond between the optic and a circuitboard.

In some exemplary embodiments of the invention, the over mold materialis dyed a particular color prior to or during the injection process;however, in other exemplary embodiments, the color of the over moldmaterial remains a natural color of the over mold material. In someexemplary embodiments, the dyed color of the over mold material acts asan indicator during the manufacturing process or maintenance of thelight module (e.g., light bar) incorporating the over mold material. Forexample, the dyed color provides an indication of the over mold materialthat it is present within the light bar. In another example, the dyedcolor provides a quick indication that the injection process has beencompleted during the manufacturing process. In certain exemplaryembodiments, color aids in the easier inspection of the over moldmaterial within the light bar. For example, the color allows faults inthe over mold material easier to detect in certain exemplaryembodiments. The color of the over mold material is chosen for itsaesthetic look or its affect on the light emitted from the light baraccording to some exemplary embodiments.

In some exemplary embodiments of the invention, the tool is designed torestrict the flow of the over mold material during the injection processsuch that there is no flow around the functioning portion of the optic.The method of injecting the over mold material over the optics istemperature sensitive. In certain exemplary embodiments, the temperatureof the over mold material during the injection process exceeds themelting point of the over mold material to allow for adequatedistribution and adhesion to the optics and the PC board. However,during the injection process the temperature of the over mold materialis not high enough to deform or degrade the material used to form theoptic. If the temperature of the over mold material causes the optic todeform or degrade, the optic performance is degraded and/or opticalignment with its corresponding LED light source is changed. As shownin FIG. 25, the temperature of the over mold material is monitored inblock 2540. If the temperature of the over mold material exceeds athreshold value, then block 2550 is invoked to reduce the temperature ofthe over mold material during the injection process. In an exampleembodiment of the invention, the temperature threshold value is atemperature value below a temperature where the optic material, which isa form of plastic, glass, or other suitable transparent or translucentmaterial, is adversely impacted or damaged by the heat. The temperatureat which the optic material is adversely impacted or damaged by the heatis referred to as the critical temperature of the optic 110. In otherexemplary embodiments of the invention, the temperature monitoringprocesses described in blocks 2540 and 2550 are avoided by limiting themeans of heating the over mold material to not exceed a particulartemperature threshold, thereby avoiding any damage to the optic and/ormisalignment of the optic.

Next, block 2560 is invoked where the over mold material cools andhardens. As the over mold material cools and hardens, the over moldmaterial becomes integrated with the optics and such the optics and theover mold material become essentially one piece. Block 2570 is theninvoked to remove the over mold material and optics as one piece fromthe tool. When coupled to the circuit board, this one piece constructionseals the LED packages and the optics in the proper alignment whileimproving the weatherproofing and tamper-proofing properties of thelight bar.

Although the blocks 2510, 2520, 2530, 2540, 2550, 2560, and 2570 arepresented and described in a certain order, one or more of the blocks2510, 2520, 2530, 2540, 2550, 2560, and 2570 are performed in adifferent order than that described according to other exemplaryembodiments. The order in which the blocks 2510, 2520, 2530, 2540, 2550,2560, and 2570 have been described are not meant to be limiting andshould not be construed as such. Also, additional blocks having certainsteps being performed can be included without departing from the scopeand spirit of the exemplary embodiment.

FIG. 26 illustrates a flowchart 2600 of a method for assembling aportion of the light bar incorporating the use of one of the adhesivelayers in accordance with one exemplary embodiment of the invention.FIG. 27 shows a perspective view of an alignment tool 2700 having one ormore optical recesses 2710 and one or more alignment features 2720 inaccordance with one exemplary embodiment. FIG. 28 shows a perspectiveview of an optical assembly 2800 in accordance with an exemplaryembodiment. FIG. 29 shows the optical assembly 2800 placed on thealignment tool 2700 in accordance with an exemplary embodiment. FIG. 30shows a backing material 3030 being removed from the optical assembly2800 to expose the adhesive material 3020 in accordance with oneexemplary embodiment. FIG. 31 shows an alignment device 3110 insertedthrough one or more alignment features 2820 of the optical assembly 2800and into the one or more vertically aligned alignment features 2720 ofthe alignment tool 2700 in accordance with an exemplary embodiment. FIG.32 shows a PC board 210 being aligned with the optical assembly 2700 inaccordance with one exemplary embodiment. FIG. 33 shows the adhesivelycoupled PC board 210 and the optical assembly 2800 being removed fromthe alignment tool 2700 in accordance with one exemplary embodiment.FIG. 34 shows the adhesively coupled PC board 210 and the opticalassembly 2800 being compressed in accordance with one exemplaryembodiment. Referring to FIGS. 26-34, the method begins at block 2610where an alignment tool 2700 having one or more optical recesses 2710and one or more alignment features 2720 is obtained. In one example,block 2610 is illustrated in FIG. 27. The alignment tool 2700 isfabricated from aluminum; however, other suitable materials, including,but not limited to, other metals, metal alloys, and polymers can be usedin other exemplary embodiments. The alignment tool 2700 includes a firstlongitudinal edge 2702, a second longitudinal edge 2704 substantiallyparallel to the first longitudinal edge 2702, a first latitudinal edge2706, and a second latitudinal edge 2708 substantially parallel to thefirst latitudinal edge 2706. Although the alignment tool 2700 isillustrated as being substantially rectangularly-shaped, the alignmenttool 2700 can be shaped into any other geometric or non geometric shape.The optical recesses 2710 are positioned on a first surface 2702 of thealignment tool 2700 and are arranged in two rows with one row havingeleven optical recesses 2710 and the second row having ten opticalrecesses 2710. The number of optical recesses 2710 is greater or fewerthan twenty-one in other exemplary embodiments and can be arranged ingreater or fewer rows. Additionally, each row includes greater or feweroptical recesses 2710 in other exemplary embodiments. The positioning ofthe optical recesses 2710 is determined by the desired positioning ofthe optics 110 in the assembled light bar. Although a certain number ofoptical recesses 2710 are positioned within the alignment tool 2700, theassembled light bar can have fewer optics 110 than the number of opticalrecesses 2710 according to some exemplary embodiments. The alignmenttool also includes one or more alignment features 2720. According tosome exemplary embodiments, the alignment feature 2720 includes anopening. However, in other exemplary embodiments, the alignment feature2720 includes a protrusion, rod, dowel, or other suitable alignmentfeature that extends substantially vertically from the first surface2702.

Next, block 2620 is invoked where the optical assembly 2800 having oneor more optics 110 and one or more alignment features 2820 is placed onthe alignment tool 2700 such that each optic 110 is placed within acorresponding optical recess 2710 and the alignment features 2720 of thealignment tool 2700 and the alignment features 2820 of the opticalassembly 2800 are substantially vertically aligned. In one example,block 2620 is illustrated in FIGS. 28 and 29. In accordance with someexemplary embodiments, the optical assembly 2800 includes one of theseveral adhesive layers that have previously been described and one ormore optics 110 adhesively coupled to the adhesive layer. The optics 110also have been previously described. However, in certain exemplaryembodiments, the optical assembly 2800 also includes the gap filler 240which is coupled to the adhesive layer and disposed around the optics110. The gap filler 240 is optional and has been previously described.

One example of the alignment features 2820 of the optical assembly 2800includes openings. In the exemplary embodiment where the alignmentfeatures 2720 of the alignment tool 2700 and the alignment features 2820of the optical assembly 2800 are openings, the alignment features 2720,2820 are positioned to be vertically aligned. In the exemplaryembodiment where the alignment features 2720 of the alignment tool 2700are a protrusion, rod, dowel, or other similar device and the alignmentfeatures 2820 of the optical assembly 2800 are openings, the alignmentfeatures 2720 are inserted through corresponding vertically alignedalignment features 2820 of the optical assembly 2800. This verticalalignment of the alignment features 2720, 2820 and insertion of theoptics 110 into the recesses 2710 facilitate proper orientation andalignment of the optics 110 once coupled to a PC board having one ormore LEDs.

An adhesive material 3020 within the adhesive layer is exposed along asurface 3010 of the optical assembly 2800. The adhesive material 3020 issimilar to the previously described adhesive materials in accordancewith the exemplary embodiments. According to some exemplary embodiments,the adhesive material 3020 is already exposed. However, according tosome other exemplary embodiments, the adhesive material 3020 is yet tobe exposed. FIG. 30 shows a backing material 3030 being removed from theoptical assembly 2800 to expose the adhesive material 3020 in accordancewith one exemplary embodiment. In the exemplary embodiments where theadhesive material 3020 is yet to be exposed, the backing material 3030is peeled off. In the exemplary embodiments where the alignment features2720 of the alignment tool 2700 are openings, an alignment device 3110,as shown in FIG. 31, is inserted through one or more alignment features2820 of the optical assembly 2800 and into the one or more verticallyaligned alignment features 2720 of the alignment tool 2700. In someexemplary embodiments, the alignment features 2720 of the alignment tool2700 are threaded and the alignment devices 3110 are screwed into thealignment features 2720.

Upon exposure of the adhesive material 3020, block 2630 is invoked wherea PC board 210 having one or more alignment features 3220 is adhesivelycoupled to the optical assembly 2800, wherein the alignment features3220 of the PC board 3210 and the alignment features 2720 of thealignment tool 2700 are vertically aligned. In one example, block 2630is illustrated in FIGS. 30-32. According to some exemplary embodiments,the alignment feature 3220 includes an opening. According to theseexemplary embodiments, the alignment features 3220 are inserted aroundthe corresponding alignment features 2720 of the alignment tool 2700 orthe alignment devices 3110 depending upon the exemplary embodiment.Although not seen in FIG. 32, the PC board 210 includes a first surface(not shown) and a second surface 3230 opposite the first surface, wherethe first surface includes one or more LEDs coupled thereto. As the PCboard 210 is adhesively coupled to the optical assembly 2800, one ormore LEDs are moved closer to a corresponding optic 110 until each optic110 surrounds one or more LEDs. At this stage, the optical assembly 2800is not hermetically sealed with the PC board 210.

Once the PC board 210 is adhesively coupled to the optical assembly2800, block 2640 is invoked where the adhesively coupled PC board 210and the optical assembly 2800 (collectively, the “light bar” 110) areremoved from the alignment tool 2700. In one example, block 2640 isillustrated in FIG. 33.

Block 2650 is invoked, where the adhesively coupled PC board 210 and theoptical assembly 2800 are compressed. At this stage, the opticalassembly 2800 becomes hermetically sealed with the PC board 210. In oneexample, block 2650 is illustrated in FIG. 34. According to oneexemplary embodiment, the adhesively coupled PC board 210 and theoptical assembly 2800 are placed in a compression tool 3410, which isthen placed into a press unit 3420. According to some exemplaryembodiments, the compression tool 3410 is fabricated using at least arubber material; however, other suitable materials, such as a polymermaterial or other compressible material, that provides some compliancecan be used. The press unit 3420 provides a force, directly orindirectly, onto the compression tool 3410 which thereby hermeticallyseals the optical assembly 2800 to the PC board 210. The force providedby the press unit 3420 is a pneumatic force according to some exemplaryembodiments, but can be other force types, such as a mechanical force,according to other exemplary embodiments.

The apparatuses and processes described above allow for the optics 110to be precisely aligned over and around the LEDs coupled to the PC board210. Thus, the desired optical performance is achievable in a repeatablemanner. Although the process utilizes a combination of manual andmachine performed steps, the steps are performable entirely manually,entirely by machine, or a combination of machine and manual steps, butdifferently than that described above in other exemplary embodiments.Although the blocks 2610, 2620, 2630, 2640, and 2650 are presented anddescribed in a certain order, one or more of the blocks 2610, 2620,2630, 2640, and 2650 are performed in a different order than thatdescribed according to other exemplary embodiments. The order in whichthe blocks 2610, 2620, 2630, 2640, and 2650 have been described are notmeant to be limiting and should not be construed as such. Also,additional blocks having certain steps being performed can be includedwithout departing from the scope and spirit of the exemplary embodiment.

FIG. 35 illustrates a flowchart of a method for assembling an opticalassembly in accordance with one exemplary embodiment of the invention.FIG. 27 shows a perspective view of an alignment tool 2700 having one ormore optical recesses 2710 and one or more alignment features 2720 inaccordance with one exemplary embodiment. FIG. 28 shows a perspectiveview of an optical assembly 2800 in accordance with an exemplaryembodiment. FIG. 36 shows an alignment tool 2700 with one or more optics110 disposed within the optical recesses 2710 in accordance with oneexemplary embodiment. FIG. 37 shows a gap filler 240 positioned on thealignment tool 2700 and surrounding the optics 110 in accordance withone exemplary embodiment. FIG. 38 shows an alignment device 3110inserted through one or more alignment features 3720 of the gap filler240 and into the one or more vertically aligned alignment features 2720of the alignment tool 2700 in accordance with an exemplary embodiment.FIG. 39 shows an adhesive layer 3905 being adhesively coupled to the gapfiller 240 and the optics 110 in accordance with one exemplaryembodiment. FIG. 40 shows the alignment device 3110 removed from thealignment tool 2700 in accordance with one exemplary embodiment. FIG. 41shows the adhesively coupled adhesive layer 3905, the gap filler 240,and the optics 110 and the alignment tool 2700 being compressed inaccordance with one exemplary embodiment. FIG. 42 shows an opticalassembly 2800 being removed from the alignment tool 2700 in accordancewith one exemplary embodiment.

Referring to FIGS. 35-42, 27, and 28, the method begins at block 3510where an alignment tool 2700 having one or more optical recesses 2710and one or more alignment features 2720 is obtained. In one example,block 3510 is illustrated in FIG. 27. The alignment tool 2700 has beendescribed above and will not be repeated again for convenience.

Next, block 3520 is invoked where an optic 110 is placed in one or moreof the optical recesses 2710 of the alignment tool 2700. In one example,block 3520 is illustrated in FIG. 36. The optics 110 has been describedabove and will not be repeated again for convenience. The domed-part ofthe optic 110 is inserted face-down into the optical recess 2710 therebyhaving the flange portion 202 of the optic 110 lie at or adjacent theplane of the alignment tool's first surface 2702. According to someexemplary embodiments, the flange portion 202 is in the same plane asthe first surface 2702. In some exemplary embodiments, an optic 110 isplaced within each optical recess 2710 formed within the alignment tool2700; however, in other exemplary embodiments, an optic 110 is notplaced in at least one optical recess 2710.

Next, block 3530 is invoked where a gap filler 240 is placed on thefirst surface 202 of the alignment tool 2700 such that the gap filler240 is disposed around the optics 110. In one example, block 3530 isillustrated in FIG. 37. The gap filler 240 has been described above andwill not be repeated again for convenience. The gap filler 240 alsoincludes one or more alignment features 3720 that are vertically alignedwith the alignment features 2720 of the alignment tool 2700 once the gapfiller 240 is placed on the alignment tool 2700.

One example of the alignment features 3720 of the gap filler 240includes openings. In the exemplary embodiments where the alignmentfeatures 2720 of the alignment tool 2700 and the alignment features 3720of the gap filler 240 are openings, the alignment features 2720, 3720are positioned to be vertically aligned. In the exemplary embodimentswhere the alignment features 2720 of the alignment tool 2700 are aprotrusion, rod, dowel, or other similar device and the alignmentfeatures 3720 of the gap filler 3720 are openings, the alignmentfeatures 2720 are inserted through a corresponding vertically alignedalignment feature 3720 of the gap filler 240. This vertical alignment ofthe alignment features 2720, 3720 and insertion of the optics 110 intothe recesses 2710 facilitate proper orientation and alignment of theoptics 110 once coupled to a PC board having one or more LEDs. Accordingto some exemplary embodiments, block 3530 is optional.

In the exemplary embodiments where the alignment features 2720 of thealignment tool 2700 is an opening, an alignment device 3110, as shown inFIG. 38, is inserted through one or more alignment features 3720 of thegap filler 240, if used, and into the one or more vertically alignedalignment features 2720 of the alignment tool 2700. In some exemplaryembodiments, the alignment features 2720 of the alignment tool 2700 arethreaded and the alignment devices 3110 are screwed into the alignmentfeatures 2720.

Next, block 3540 is invoked where an adhesive layer 3905 is adhesivelycoupled to the gap filler 240, if used, and the flange portion 202 ofthe optics 110. In the exemplary embodiments where the gap filler 240 isnot used, the adhesive layer 3905 is adhesively coupled to the flangeportion 202 of the optics 110. Block 3540 is illustrated in FIG. 39. Theadhesive layer 3905 is similar to the adhesive layers described aboveand will not be repeated again for convenience. An adhesive material3930, which is similar to previously described adhesive materials, isexposed along a surface 3907 of the adhesive layer 3905. According tosome exemplary embodiments, the adhesive material 3930 is alreadyexposed. However, according to some other exemplary embodiments, theadhesive material 3930 is yet to be exposed. Although not illustratedand according to some exemplary embodiments, a backing material isremoved from the surface 3907 of the adhesive layer 3905 to expose theadhesive material 3930, similar to that shown in FIG. 30. In theexemplary embodiments where the adhesive material 3930 is yet to beexposed, the backing material is peeled off. The adhesive layer 3905also includes one or more alignment features 3920. When adhesivelycoupling the adhesive layer 3905 to the gap filler 240, the alignmentfeatures 3920 of the adhesive layer 3905 and the alignment features 2720of the alignment tool 2700 are vertically aligned. According to someexemplary embodiments, the alignment features 3920 include openings.According to these exemplary embodiments, the alignment features 3920are inserted around corresponding alignment features 2720 of thealignment tool 2700 or the alignment devices 3110 depending upon theexemplary embodiment. As the adhesive layer 3905 is adhesively coupledto the optics 110 and the gap filler 240, the adhesive layer 3905 is notyet hermetically sealed with the gap filler 240 and the optics 110 atthis stage.

To prepare for the compression of the adhesive layer 3905 to the gapfiller 240 and the optics 110, the alignment devices 3110, if used, areremoved from the alignment tool 2700, as illustrated in FIG. 40. Next,block 3550 is invoked where the adhesive layer 3905, the gap filler 240,and the optics 110 are compressed while disposed on the alignment tool2700. At this stage, the adhesive layer 3905 becomes hermetically sealedto the optics 110 and the gap filler 240, if used. In one example, block3550 is illustrated in FIG. 41. According to one exemplary embodiment,the adhesively coupled adhesive layer 3905, the optics 110, and the gapfiller 240, while disposed on the alignment tool 2700 are placed in thepress unit 3420. The press unit 3420 provides a force onto the alignmenttool 2700 which thereby hermetically seals the adhesive layer 3905 tothe optics 110 and the gap filler 240. The force provided by the pressunit 3420 is a pneumatic force according to some exemplary embodiment,but can be other force types, such as a mechanical force, according toother exemplary embodiments.

Once the adhesive layer 3905 is compressed to the optics 110 and the gapfiller 240, block 3560 is invoked where the adhesive layer 3905, the gapfiller 240, and the optics 110 form the optical assembly 2800, which hasbeen previously described. The optical assembly 2800 is removed from thealignment tool 2700. In one example, block 3560 is illustrated in FIG.42. In some exemplary embodiments, the optical assembly 2800 is usedwithin the method 2600 (FIG. 26) to form light bar 100 (FIG. 1).

The precision alignment of the optics onto the adhesive layer areperformed in a repeatable manner. Although the process utilizes acombination of manual and machine performed steps, the steps areperformable entirely manually, entirely by machine, or a combination ofmachine and manual steps, but differently than that described above inother exemplary embodiments. Although the blocks 3510, 3520, 3530, 3540,3550 and 3560 are presented and described in a certain order, one ormore of the blocks 3510, 3520, 3530, 3540, 3550 and 3560 are performedin a different order than that described according to other exemplaryembodiments. The order in which the blocks 3510, 3520, 3530, 3540, 3550and 3560 have been described are not meant to be limiting and should notbe construed as such. Also, additional blocks having certain steps beingperformed can be included without departing from the scope and spirit ofthe exemplary embodiment.

FIG. 43 is an exploded view of an LED light bar 4300 without the cover120 in accordance with another exemplary embodiment of the presentinvention. Referring now to FIG. 43, the exemplary LED light bar 4300includes the PC board 210, one or more LEDs or LED die packages 220mounted to the PC board 210, an adhesive layer 4310, the gap filler 240,and one or more optics 110. The construction of the LED light bar 4300is similar in construction to the LED light bar 100 (FIG. 3) except thatthe construction of the adhesive layer 4310 is different than theconstruction of the adhesive layer 230 (FIG. 3). For the sake ofbrevity, the descriptions for each of components of the LED light bar4300 which are similar to the components of the LED light bar 100 (FIG.3) are not described again in detail below.

According to FIG. 43, the adhesive layer 4310 includes a sandwich oflayers to adhere at least the flange portion 202 of one or more optics110 that are disposed over each LED or LED die package 220 and the PCboard 210. The adhesive layer 4310 includes three layers; however,greater or fewer number of layers are used to form the adhesive layer4310 in other exemplary embodiments. The sandwich of layered materialsincludes a material layer 4330. According to some exemplary embodiments,this material layer 4330 is substantially rectangular in shape; however,the shape is of another geometric shape or non-geometric shape dependingupon the shape of the light bar 4300 according to other exemplaryembodiments. According to some exemplary embodiments, the material layer4330 includes a first longitudinal edge 4331, a second longitudinal edge4332 substantially parallel to the first longitudinal edge 4331, a firstlatitudinal edge 4333 extending from the end of the first longitudinaledge 4331 to the respective adjacent end of the second longitudinal edge4332, and a second latitudinal edge (not shown) extending from theopposing end of the first longitudinal edge 4331 to the respectiveopposing end of the second longitudinal edge 4332. This material layer4330 is fabricated using a non-gas-permeable material according to someexemplary embodiments. However, according to some exemplary embodiments,the material layer 4330 is fabricated using a gas-permeable layer,including, but not limited to, Tyvek®, high density polyethylene,burlap, canvas, and silicone. The material layer 4330 includes severalfirst openings 4335 for receiving therethrough the LED or LED diepackages 220. The material layer 4330 also includes several secondopenings 4336 for receiving therethrough the LED drivers 310 and forproviding an opening about the apertures 212 in the PC board 210 forreceiving screws 105 (FIG. 1). Further, the material layer 4330 includesone or more channels 4337 extending from each first opening 4335 to theedge 4331, 4332, and 4333 of the material layer 4330. According to someexemplary embodiments, the channels 4337 extend from each first opening4335 to at least one of the first longitudinal edge 4331 or the secondlongitudinal edge 4332. The channels 4337 are formed in the materiallayer 4330 either when the material layer 4330 is formed or after thematerial layer 4330 is formed. For example, the channels 4337 are formedby cutting the material layer 4330.

The adhesive layer 4310 also includes a first adhesive material 4320 onthe bottom side of the material layer 4330 and a second adhesivematerial 4340 on the top side of the material layer 4330. These adhesivematerials 4320, 4340 are fabricated using a non-gas-permeable materialaccording to some exemplary embodiments; however, a gas-permeablematerial, such as an acrylic adhesive or a silicone adhesive, are usedto fabricate the adhesive materials 4320, 4340 according to otherexemplary embodiments. The material used to fabricate the first adhesivematerial 4320 is the same material that is used to fabricate the secondadhesive material 4340. However, the first adhesive material 4320 isfabricated using a different material than used to fabricate the secondadhesive material 4340 according to other exemplary embodiments. In oneexemplary embodiment, the adhesive materials 4320, 4340 are a viscous orsemi-viscous material that is applied to the material layer 4330 and hassubstantially the same shape as the material layer 4330. For example,the material layer 4330 includes several first openings 4335 forreceiving therethrough the LED or LED die packages 220, several secondopenings 4336 for receiving therethrough the LED drivers 310 and forproviding an opening about the apertures 212 in the PC board 210 forreceiving screws 105 (FIG. 1), and a channel 4337 extending from thefirst opening 4335 to an edge 4331, 4332, and 4333 of the material layer4330. Thus, the application of the viscous or semi-viscous material onthe material layer 4330 to form both the first and second adhesivematerials 4320, 4340 also forms matching first openings 4325, 4345,matching second openings 4326, 4346, and matching channels 4327, 4347 inboth the first adhesive material 4320 and the second adhesive material4340, respectively. The first openings 4325, 4335, and 4345 are allvertically aligned. The second openings 4326, 4336, and 4346 are allvertically aligned. The channels 4327, 4337, and 4347 are all verticallyaligned. In an alternative embodiment, the first and second adhesivematerials 4320, 4340 are laminated onto the bottom side and the top sideof the material layer 4330. After the first and second adhesivematerials 4320, 4340 are applied onto the material layer 4330, they aredie cut to provide first openings 4325, 4335, and 4345, the secondopenings 4326, 4336, and 4346, and the channels 4327, 4337, and 4347 ineach of the adhesive materials 4320, 4340 and the material layer 4330.Although first openings 4325, 4335, and 4345 and second openings 4326,4336, and 4346 are illustrated as being round-shaped, any of the firstopenings 4325, 4335, and 4345 and/or the second openings 4326, 4336, and4346 can be any geometric or non-geometric shape according to otherexemplary embodiments. Further, although channels 4327, 4337, and 4347are illustrated as being substantially rectangular-shaped, the channels4327, 4337, and 4347 can be any geometric or non-geometric shapeaccording to other exemplary embodiments.

The first adhesive material 4320 on the bottom side of the materiallayer 4330 allows the material layer 4330 to adhere to the PC board 210.The second adhesive material 4340 on the top side of the material layer4330 allows multiple optics 110 and a layer of the gap filler 240, ifused, to adhere to the material layer 4330. The second adhesive material4340 provides a seal around the perimeter of each optic 110. Those ofordinary skill in the art will recognize however, that the size andshape of the first openings 4325, 4335, and 4345 in the material layer4330 and the adhesive materials 4320, 4340 can be adjusted based on theshape of the LED or LED die package 220 and the optic 110 being used inthe particular lighting application. Although the adhesive layer 4310 ofthis exemplary embodiment is described with respect to the adhesivelayer 230 (FIG. 3), the modification made to the adhesive layer 230(FIG. 3) to form the adhesive layer 4310 is performable on the adhesivelayers from any of the exemplary embodiments described above or below.

FIG. 44 is a top plan view of a portion of the LED light bar 4300 ofFIG. 43 showing representative air paths 4410 between the LED diepackage 220 and the outside environment in accordance with the exemplaryembodiment of FIG. 43. Referring now to FIGS. 43 and 44, when the LED orLED die package 220 that is mounted onto the PC board 210 is turned on,it generates heat. The build up of heat increases the pressure inside ofthe optic 110. As the pressure increases beyond the pressure of theoutside environment, the air or gas inside of the optic 110, which mayinclude contaminants, wants to move to an area of lower pressure, whichincludes the outside environment. The material layer 4330, the firstadhesive material 4320, and the second adhesive material 4340 disposedabout the LED or LED die package 220 provide a pathway for the air (andany airborne contaminants), also referred to as an air path 4410, totransition the air or gas from between the area under the optic 110 andthe outside environment. In accordance with an exemplary embodimentwhere the adhesive layer 4310 is not air or gas-permeable, the air paths4410 are oriented substantially horizontally through the channels 4327,4337, and 4347. As shown in FIG. 44 and with reference to FIG. 43, forinstance, the air moves laterally under the gap filler 240 and throughthe material layer 4330 to the perimeter of the light bar 4300 via thechannels 4327, 4337, and 4347. The air (and any airborne contaminants)then exits the light bar 100.

It also is possible for air to flow in the opposite direction as shownin FIG. 44, from the outside environment into the area surrounding theLED or LED die package 220 under the optic 110. For example, when theLED or LED die package 220 is turned off, the LED or LED die package 220cools and the area under the optic 110 also cools. This cooling resultsin a pressure drop inside the area under the optic 110, thereby drawingair towards the LED or LED die package 220. Air is able to flow from theoutside environment to the LED or LED die package 220 in a mannersubstantially similar to, but in the reverse of that described above.

FIG. 45 is a partially exploded view of a portion of an LED light bar4500 with one or more air channels 4510 in accordance with anotherexemplary embodiment of the present invention. Referring now to FIG. 45,the exemplary LED light bar 4500 includes the PC board 210, one or morelayers of coating 4515 along the top surface of the PC board 210, one ormore LEDs or LED die packages 220 mounted to the PC board 210, and alens set 4520, which includes one or more optics 110. The constructionof the LED light bar 4500 is similar in construction to the LED lightbar 1600 (FIG. 16) except that the placement of the layers of coating4515 on the top surface of the PC board 210 is different than placementof the layers of coating 1615 (FIG. 16) and the lens set 4520 isdifferent than the lens set 1620 (FIG. 16). For the sake of brevity, thedescriptions for each of components of the LED light bar 4500 which aresimilar to the components of the LED light bar 1600 (FIG. 16) are notdescribed again in detail below.

According to some exemplary embodiments, the PC board 210 issubstantially rectangular in shape; however, the shape is of anothergeometric shape or non-geometric shape depending upon the shape of thelight bar 4500 according to other exemplary embodiments. According tosome exemplary embodiments, the PC board 210 includes a firstlongitudinal edge 4551, a second longitudinal edge 4552 substantiallyparallel to the first longitudinal edge 4551, a first latitudinal edge4553 extending from the end of the first longitudinal edge 4551 to therespective adjacent end of the second longitudinal edge 4552, and asecond latitudinal edge (not shown) extending from the opposing end ofthe first longitudinal edge 4551 to the respective opposing end of thesecond longitudinal edge 4552. The first longitudinal edge 4551, thesecond longitudinal edge 4552, the first latitudinal edge 4553, and thesecond latitudinal edge are collectively referred to as edges of the PCboard 220.

The PC board 210 also includes one or more LED drivers 310 (FIG. 3) thatprovide power to the LEDs or LED die packages 220 that are mounted tothe PC board 210. In addition, the PC board 210 includes circuit traces1605 electrically coupled to the LED driver 310 (FIG. 3) and the LEDs orLED die packages 220. The circuit traces 1605 transmit power and/orcontrol signals from the LED driver 310 (FIG. 3) to the LEDs or LED diepackages 220.

The PC board 210 also includes one or more layers of coating 4515 alongthe top surface of the PC board 210. According to some exemplaryembodiments, the layers of coating 4515 includes a layer of solder mask.However, in alternative embodiments, the layers of coating 4515 includesconformal coating or other hard coatings known to people having ordinaryskill in the art. In certain exemplary embodiments, multiple layers ofsolder mask 4515 are applied to the PC board 210. During application,portions of the PC board 210 are selectively coated using screenprinting or other coating techniques to apply one or multiple layers ofcoating 4515. These portions are typically adjacent to the LEDs or LEDdie packages 220. By selectively applying the layers of coating 4515 tocertain parts of the PC board 210, air channels 4510 are formed alongthe top surface of the PC board 210. These air channels 4510, incontrast from the air channels 1610 (FIG. 16), extend from each of theLEDs or LED die packages 220 to one or more edges 4551, 4552, and 4553of the PC board 210. Alternatively, One or more of the air channels 4510combine with one or more other air channels 4510 before extending to oneor more edges 4551, 4552, and 4553 of the PC board 210 according toother exemplary embodiments.

The lens set 4520 is similar to the components used in FIG. 43 andincludes the optics 110, the gap filler 240, and the adhesive layer4310, which have been described with respect to FIG. 43 and also withrespect to other exemplary embodiments. For the sake of brevity, thesecomponents are not described in detail again. The gap filler 240 isoptional according to some exemplary embodiments. The channels 4327,4337, and 4347 (FIG. 43) are vertically aligned with the respective airchannels 4510. According to some exemplary embodiments, the channels4327, 4337, and 4347 (FIG. 43) are not formed in the adhesive layer 4310when used in this exemplary embodiment. Once the lens set 4520, eitherwith or without the channels 4327, 4337, and 4347 (FIG. 43), is disposedon the layers of coating 4515, the air channels 4510 are completelyformed and provide a direct fluid communication, which is along thesurface of the PC board 210, for air to flow between the cavity of theoptic 110 and the surrounding environment. The adhesive layer 4310 usedin this exemplary embodiment can be constructed similarly to any of thepreviously described adhesive layers and can include greater or fewerlayers according to other exemplary embodiments.

As shown in FIG. 45, when the LED or LED die package 220 that is mountedto the PC board 210 is turned on, it generates heat. The build up ofheat increases the pressure inside of optic 110. As the pressureincreases beyond the pressure of the outside environment, the air insideof the optic 110, which may include contaminants, wants to move to anarea of lower pressure, which includes the outside environment. The airmoves laterally along air path 4505 through the air channel 4510 untilit reaches one of the edges 4551, 4552, 4553 of the PC board 210, wherethe air then escapes to the outside environment of the light bar 4500.It is also possible for air to flow in the opposite direction, from theoutside environment to the area surrounding the LED or LED die package220 under the optic 110.

FIG. 46 is a partially exploded view of a portion of an LED light bar4600 with one or more air channels 4610 in accordance with anotherexemplary embodiment of the present invention. Referring now to FIG. 46,the exemplary LED light bar 4600 includes the PC board 210, one or moreLEDs or LED die packages 220 mounted to the PC board 210, and a lens set4520, which includes one or more optics 110. The construction of the LEDlight bar 4600 is similar in construction to the LED light bar 1900(FIG. 19) except that the placement of the etched air channels 4610within the top surface of the PC board 210 is different than placementof the etched air channels 1905 (FIG. 19) and the lens set 4520 isdifferent than the lens set 1620 (FIG. 19). For the sake of brevity, thedescriptions for each of components of the LED light bar 4600 which aresimilar to the components of the LED light bar 1900 (FIG. 19) are notdescribed again in detail below.

According to some exemplary embodiments, the PC board 210 issubstantially rectangular in shape; however, the shape is of anothergeometric shape or non-geometric shape depending upon the shape of thelight bar 4600 according to other exemplary embodiments. According tosome exemplary embodiments, the PC board 210 includes a firstlongitudinal edge 4551, a second longitudinal edge 4552 substantiallyparallel to the first longitudinal edge 4551, a first latitudinal edge4553 extending from the end of the first longitudinal edge 4551 to therespective adjacent end of the second longitudinal edge 4552, and asecond latitudinal edge (not shown) extending from the opposing end ofthe first longitudinal edge 4551 to the respective opposing end of thesecond longitudinal edge 4552. The first longitudinal edge 4551, thesecond longitudinal edge 4552, the first latitudinal edge 4553, and thesecond latitudinal edge are collectively referred to as edges of the PCboard 220.

The PC board 210 also includes one or more LED drivers 310 (FIG. 3) thatprovide power to the LEDs or LED die packages 220 that are mounted tothe PC board 210. In addition, the PC board 210 includes circuit traces1605 electrically coupled to the LED driver 310 (FIG. 3) and the LEDs orLED die packages 220. The circuit traces 1605 transmit power and/orcontrol signals from the LED driver 310 (FIG. 3) to the LEDs or LED diepackages 220.

The PC board 210 also includes one or more air channels 4610photo-chemically, laser, or mechanically etched into the top surface ofthe PC board 210. These air channels 4610 are typically adjacent to theLEDs or the LED die packages 220 and extend outwardly from the LEDs orthe LED die packages 220 and towards another LED or LED die package 220.According to some exemplary embodiments, the air channels 4610, incontrast from the air channels 1905 (FIG. 19), extend from each of theLEDs or LED die packages 220 to one or more edges 4551, 4552, and 4553of the PC board 210. Alternatively, one or more of the air channels 4610combine with one or more other air channels 4610 before extending to oneor more edges 4551, 4552, and 4553 of the PC board 210 according toother exemplary embodiments. In some exemplary embodiments, the PC board210 also includes one or more layers of coating 4515 along the topsurface of the PC board 210 in conjunction with the etched air channels4610. The layers of coating 4515 used in this exemplary embodiment aresubstantially similar to the layers of coating 4515 used in theembodiment described in FIG. 45 and will therefore not be describedfurther.

The lens set 4520 is similar to the lens set 4520 used in the exemplaryembodiment described in FIG. 45. For the sake of brevity, this componentis not described in detail again. The lens set 4520 is modifiableaccording to the description provided with FIG. 45. Once the lens set4520, either with or without the channels 4327, 4337, and 4347 (FIG.43), is disposed on the top surface of the PC board 210, the airchannels 4610 are completely formed and provide a direct fluidcommunication, which is substantially along the surface of the PC board210, for air to flow between the cavity of the optic 110 and thesurrounding environment.

The air flow within the air channels 4610 is similar to the air flowwithin the air channels 4510 (FIG. 45) of FIG. 45. In short, the airmoves laterally along air path 4605 through the air channel 4610 untilit reaches one of the edges 4551, 4552, 4553 of the PC board 210, wherethe air then escapes to the outside environment of the light bar 4600.It is also possible for air to flow in the opposite direction, from theoutside environment to the area surrounding the LED or LED die package220 under the optic 110.

Although each exemplary embodiment has been described in detail, it isto be construed that any features and modifications that are applicableto one embodiment are also applicable to the other embodiments.Furthermore, although the invention has been described with reference tospecific embodiments, these descriptions are not meant to be construedin a limiting sense. Various modifications of the disclosed embodiments,as well as alternative embodiments of the invention will become apparentto persons of ordinary skill in the art upon reference to thedescription of the exemplary embodiments. It should be appreciated bythose of ordinary skill in the art that the conception and the specificembodiments disclosed may be readily utilized as a basis for modifyingor designing other structures or methods for carrying out the samepurposes of the invention. It should also be realized by those ofordinary skill in the art that such equivalent constructions do notdepart from the spirit and scope of the invention as set forth in theappended claims. It is therefore, contemplated that the claims willcover any such modifications or embodiments that fall within the scopeof the invention.

1. A light module, comprising: a plurality of light emitting diodes(LEDs) coupled to a circuit board; at least one lens, each lens disposedover at least one LED of the plurality of LEDs, wherein the lensincludes a flange extending from at least one side of the lens; and anadhesive layer between the circuit board and the lens, wherein theadhesive layer fixes the lens in an optical alignment over thecorresponding LED.
 2. The light module of claim 1, wherein the adhesivelayer comprises a gas-permeable layer.
 3. The light module of claim 1,wherein the adhesive layer comprises a deposited adhesive material. 4.The light module of claim 3, wherein the adhesive material is silicone.5. The light module of claim 1, wherein the plurality of LEDs comprisean array of LED die packages.
 6. The light module of claim 5, whereinthe light module is coupled to a light fixture housing.
 7. The lightmodule of claim 1, wherein the lens comprises a mirror portion.
 8. Thelight module of claim 1, further comprising a gap filler, wherein thegap filler is coupled to the adhesive layer and surrounds the flangeportion extending from at least one side of the lens.
 9. The lightmodule of claim 1, further comprising a cover, the cover comprising oneor more apertures, each aperture allowing at least a portion of one ormore lenses to extend therethrough.
 10. The light module of claim 1,wherein the adhesive layer comprises: a gas-permeable layer comprising atop side and a bottom side, the gas-permeable layer disposed between thecircuit board and each lens; a first adhesive material disposed on thebottom side; and a second adhesive material disposed on the top side.11. The light module of claim 1, wherein the adhesive layer comprises: atape layer comprising a top side and a bottom side, the tape layerdisposed between the circuit board and each lens; a first adhesivematerial disposed on the bottom side; and a second adhesive materialdisposed on the top side.
 12. The light module of claim 11, wherein thetape layer further comprises a first portion and a second portion, thesecond portion extending longitudinally along a generally centralportion of the light module, the first portion disposed along eachlongitudinal side of the second portion and along each longitudinal edgeof the light module, the first portion being more gas-permeable than thesecond portion.
 13. The light module of claim 1, wherein the adhesivelayer comprises: a first layer between the circuit board and each lens,wherein the first layer further comprises: a plurality of firstopenings, each first opening configured to be disposed around at least aportion of one of the LEDs; and a plurality of first apertures, eachfirst aperture in fluid communication with one of the first openings andextending outside of a footprint of the lens disposed over theassociated first opening; a second layer between each LED and lens,wherein the second layer further comprises: a plurality of secondopenings, each second opening configured to be disposed around at leasta portion of one of the LEDs and substantially vertically aligned withone of the plurality of first openings; and a plurality of thirdopenings, each third opening vertically aligned with and in fluidcommunication with at least one of the first apertures; a first adhesivematerial disposed between the first layer and the circuit board andadhering the first layer to the circuit board; a second adhesivematerial disposed between the first layer and the second layer andadhering the first and second layers together; and a third adhesivematerial disposed above the second layer.
 14. The light module of claim1, wherein the adhesive layer comprises at least one of a siliconeadhesive material and an acrylic adhesive material. 15-24. (canceled)25. A method of manufacturing a light module, comprising: providing aplurality of light emitting diode (LED) die packages coupled to acircuit board, wherein the LED die package comprises an LED and aprimary lens; providing at least one secondary lens, each secondary lensdisposed over at least one LED of the plurality of LEDs, wherein thesecondary lens includes a flange extending from at least one side of thesecondary lens; providing an adhesive layer between the circuit boardand the secondary lens, wherein the adhesive layer fixes the secondarylens in an optical alignment over the LED die package.
 26. The method ofclaim 25, wherein the adhesive layer comprises a gas-permeable layer.27. A light module, comprising: a plurality of light emitting diodes(LEDs) coupled to a circuit board; at least one lens, each lens disposedover at least one LED of the plurality of LEDs, wherein the lensincludes a flange extending from at least one side of the lens; and agas-permeable layer disposed between the circuit board and each lens,wherein the gas-permeable layer further comprises a top side and abottom side, the bottom side comprising a first adhesive material andthe top side comprising a second adhesive material; wherein the firstadhesive material on the bottom side adheres the gas-permeable layer tothe circuit board and the second adhesive material on the top side fixesthe lens in an optical alignment over the corresponding LED.
 28. Thelight module of claim 27, wherein the gas-permeable layer comprisessilicone.
 29. The light module of claim 27, wherein the first adhesivematerial and the second adhesive material are the same.
 30. The lightmodule of claim 27, further comprising a gap filler disposed adjacent atleast a portion of the flange extending from at least one side of thelens and adhered to the second adhesive material on the top side of thegas-permeable layer.
 31. The light module of claim 30, wherein the gapfiller is high density polyethylene film.
 32. The light module of claim30, wherein the gap filler is gas-permeable.
 33. The light module ofclaim 27, wherein the gas-permeable layer comprises a deposited adhesivesilicone material.
 34. The light module of claim 27, wherein theplurality of LEDs comprise an array of LED die packages.
 35. The lightmodule of claim 27, wherein the light module is coupled to a lightfixture housing.
 36. The light module of claim 27, further comprising acover, the cover comprising one or more apertures, each apertureallowing at least a portion of one or more lenses to extendtherethrough.
 37. The light module of claim 27, wherein at least one ofthe first adhesive material and the second adhesive material comprisesat least one of a silicone adhesive material and an acrylic adhesivematerial.
 38. A light module, comprising: a plurality of light emittingdiodes (LEDs) coupled to a circuit board; at least one lens, each lensdisposed over at least one LED of the plurality of LEDs, wherein thelens includes a flange extending from at least one side of the lens; anda tape layer disposed between the circuit board and each lens, whereinthe tape layer further comprises a top side and a bottom side, thebottom side comprising a first adhesive material and the top sidecomprising a second adhesive material; wherein the first adhesiveadheres the tape layer to the circuit board.
 39. The light module ofclaim 38, wherein the tape layer comprises a first portion and a secondportion, wherein the first portion is more gas-permeable than the secondportion.
 40. The light module of claim 39, wherein the second portionextends longitudinally along a generally central portion of the lightmodule and wherein the first portion is disposed along each longitudinalside of the second portion and along each longitudinal edge of the lightmodule.
 41. The light module of claim 39, wherein the first portioncomprises gas-permeable tape.
 42. The light module of claim 41, whereinthe first portion comprises TESA tape.
 43. The light module of claim 39,wherein the first portion comprises non-woven fabric tape.
 44. The lightmodule of claim 39, wherein the second portion comprises glass fibertape.
 45. The light module of claim 38, further comprising a gap fillerdisposed adjacent at least a portion of the flange extending from atleast one side of the lens and adhered to the second adhesive materialon the top side of the tape layer.
 46. The light module of claim 45,wherein the gap filler comprises high density polyethylene film.
 47. Thelight module of claim 45, wherein the gap filler is gas-permeable. 48.The light module of claim 38, wherein at least one of the first adhesivematerial and the second adhesive material comprises at least one of asilicone adhesive material and an acrylic adhesive material.
 49. Thelight module of claim 48, wherein the second adhesive material comprisesa deposited adhesive silicone material.
 50. The light module of claim38, wherein the tape layer comprises non-woven fabric tape.
 51. Thelight module of claim 38, wherein the tape layer comprises gas-permeabletape.
 52. The light module of claim 51, wherein the gas-permeable tapecomprises TESA tape. 53-89. (canceled)
 90. A light module, comprising: acircuit board comprising a top surface; a plurality of light emittingdiodes (LEDs) coupled to the circuit board; at least one lens, each lensdisposed over at least one LED of the plurality of LEDs, wherein thelens comprises a lens cavity; an adhesive layer disposed between thecircuit board and each lens, wherein the adhesive layer comprises aplurality of first openings, each first opening configured to bedisposed substantially around at least a portion of one of the LEDs; andat least one air channel formed substantially along the top surface ofthe circuit board, the air channels extending from at least one lenscavity to an edge of the light module, the air channels providing fluidcommunication between at least one lens cavity and an outsideenvironment located exterior to the light module.
 91. The light moduleof claim 90, wherein one or more air channels are etched into thecircuit board.
 92. The light module of claim 90, further comprising aconformal coating applied to a portion of the top surface of the circuitboard, wherein the application of the coating to only a portion of thecircuit board creates at least one of the air channels on the topsurface of the circuit board.
 93. The light module of claim 90, whereinat least one of the air channels is formed in the adhesive layer andextends from at least one of the first openings to an edge of theadhesive layer.